Single-Layer Glass Electronic Component Outer-Surface Conductor Design
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Solution Overview
Problem
Electronic components with internal conductors in multi-layer glass bodies face issues such as shape and positional variations, internal stress, and reduced resistance to external forces and heat due to firing processes, which affect their electrical characteristics and reliability.
Innovation Solution
A single-layer glass plate with outer-surface conductors and terminal electrodes disposed above its surface, eliminating the need for internal conductors and reducing the influence of firing, while allowing for precise formation of cavities and crystallization portions to adjust dielectric constants and stray capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-layer glass body with internal conductor is used, then insulation property and physical/chemical stability are improved, but shape and positional variations occur due to firing process
Solution Approach 1:
The invention divides the conductor into two separate components: internal conductors embedded in the glass body and external conductors formed on the surface after firing. This segmentation allows the internal conductor to provide structural stability while the external conductor achieves precise positioning, resolving the contradiction between reliability and manufacturing precision.
Solution Approach 2:
The internal conductor is formed by embedding conductor paste in glass green sheets before firing. This preliminary action creates a stable structural foundation that withstands the firing process, while subsequent external conductor formation achieves precise positioning without being affected by firing-induced variations.
2Strength
If internal conductor is placed in multi-layer glass body, then structural integrity is improved, but internal stress accumulates due to thermal expansion coefficient differences
Solution Approach 1:
By separating the conductor into internal and external portions, the invention reduces the volume of conductor material embedded in the glass body. This reduces the thermal expansion coefficient mismatch and minimizes internal stress accumulation while maintaining structural integrity through the external conductor layer.
Solution Approach 2:
The invention applies different conductor configurations to different regions: internal conductors provide structural support where needed, while external conductors provide precise electrical connections. This local differentiation optimizes both structural integrity and stress distribution.
3Reliability
If internal conductor is formed on paste, then electrical connection is achieved, but material and construction method selection is limited due to high temperature resistance requirement
Solution Approach 1:
The conductor is divided into internal and external portions with different functional requirements. The internal conductor uses materials suitable for high-temperature firing, while the external conductor can use a broader range of materials optimized for electrical performance and precision positioning, thereby expanding material and construction method selection.
Solution Approach 2:
The internal conductor acts as an intermediary that provides thermal stability during firing, while the external conductor serves as the primary electrical connection element. This intermediary structure allows independent optimization of materials and construction methods for each portion.
4Device complexity
If conductor paste is positioned at interface of stacked glass green sheets, then multi-layer structure is formed, but crack risk and wire breaking risk increase due to concentrated internal stress
Solution Approach 1:
By moving the primary conductor function to external conductors formed after firing, the invention reduces the amount of conductor paste positioned at stress-prone interfaces during stacking. This segmentation reduces concentrated internal stress and lowers crack and wire breaking risks while maintaining the multi-layer glass structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the precision and reliability of electronic components by minimizing firing-induced variations, reducing internal stress, and improving their mechanical and electrical properties, including reduced stray capacitance and increased mounting efficiency.
Implementation Method 1
the glass pastes have been sintered and an internal conductor in which the conductor paste has been sintered
Implementation Method 2
the individual pieces are fired, and the multi-layer glass body in which the glass pastes have been sintered
Implementation Method 3
glass powder and conductor powder are baked and tightened in addition to organic material, which is a paste component, being volatilized
Implementation Method 4
the end portions of the internal conductor exposed from the multi-layer glass body are plated to form a terminal electrode
Data Source
AI summary
An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.