Single-Layer Interconnect Substrate for 3D-Printed Chip Packaging
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Solution Overview
Problem
The semiconductor packaging industry faces high costs due to complex interconnection processes, and existing facilities struggle to produce customized semiconductor chips for diverse applications such as IT, AI, vehicles, and smart factories.
Innovation Solution
The implementation of 3D printing technology for customized semiconductor packaging allows for the simplification of interconnection processes, reduction of costs, and creation of substrates with specific shapes and interconnection structures, thereby optimizing process costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional interconnection processes are used in semiconductor packaging, then electrical connection structures can be formed, but manufacturing costs increase sharply due to process complexity
Solution Approach 1:
The patent changes the manufacturing parameters from traditional multi-step semiconductor fabrication to 3D printing parameters (layer thickness, infill density, material composition). This allows direct formation of interconnection structures with customized geometries, reducing process complexity while maintaining electrical connection reliability through controlled material deposition and curing parameters.
Solution Approach 2:
The patent transitions from planar 2D interconnection patterns to 3D volumetric interconnection structures. The 3D printing process enables conductive pathways to extend through the thickness of the substrate, creating three-dimensional electrical networks that reduce the number of layers and interconnection steps required in traditional packaging.
2Productivity
If conventional semiconductor production facilities are used, then standardized chips can be produced, but customization for diverse applications becomes difficult
Solution Approach 1:
The patent implements dynamic adaptability through software-controlled 3D printing parameters. The system can dynamically adjust layer thickness, infill patterns, material composition, and interconnection geometry based on specific application requirements (IT, AI, automotive, smart factory), enabling rapid customization without retooling while maintaining high production efficiency through automated printing processes.
Solution Approach 2:
The 3D printing-based substrate manufacturing system serves multiple functions: it can produce different substrate geometries, integrate various interconnection patterns, incorporate multiple materials (conductive and dielectric), and accommodate different electronic components. This universal platform replaces multiple specialized production lines, achieving both productivity and versatility.
3Adaptability or versatility
If interconnection structures of various patterns are created, then customized packaging is achieved, but manufacturing costs increase sharply
Solution Approach 1:
The 3D printing process enables self-service customization where the substrate structure is directly fabricated according to digital designs without requiring external tooling or masks for each pattern. The digital model automatically translates to the physical interconnection structure, eliminating the need for separate photolithography and etching processes for each customization scenario.
Solution Approach 2:
The patent merges the substrate fabrication and interconnection formation processes into a single 3D printing operation. Conductive and dielectric materials are deposited in alternating layers with integrated patterning, combining what were traditionally separate manufacturing steps into one unified process, thereby reducing complexity and cost while enabling customization.
Data Source
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AI summary
According to various embodiments, a substrate for electrical connection between electronic components may include: a body having a single layer structure; and at least one interconnect having a conductivity formed inside the body, wherein the at least one interconnect includes one side and the other side exposed to the outside of the body, and a line connecting the one side and the other side, and wherein the line is crossed in a transverse direction or a longitudinal direction through the inside of the body of the single layer structure, and may be implemented to have a specific curvature in some sections. Other various embodiments are possible.