Single-Layer Metal Wiring for Backlight Source Short Circuit Prevention
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Solution Overview
Problem
Existing backlight products face issues of easy shorting between different metal layers and high cost due to multi-layer metal wiring methods, which are not compatible with single-layer metal designs.
Innovation Solution
A backlight source with a substrate, a circuit layer, and light emitting units, where signal, data, power, and ground traces are all at the same layer, connected to corresponding pads, allowing for single-layer metal wiring without redesigning the driver chip, thus preventing short circuits and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-layer metal wiring method is used, then electrical connectivity is achieved, but shorting between different metal layers occurs and cost increases
Solution Approach 1:
The patent extracts and eliminates the multi-layer metal structure, reducing it to a single-layer metal wiring design. This removes the interface between multiple metal layers that causes shorting, while maintaining all necessary electrical connectivity functions through careful trace routing and pad placement on the single layer.
Solution Approach 2:
The patent transitions from a vertical multi-layer architecture to a horizontal single-layer architecture. All signal, data, power, and ground routes are planned and routed on the same plane, using dimensional arrangement rather than vertical stacking to achieve electrical connectivity without inter-layer shorting risks.
2Reliability
If multi-layer metal wiring method is used, then electrical connectivity is achieved, but manufacturing cost increases
Solution Approach 1:
The patent removes the complex multi-layer metal stacking process, retaining only the single-layer metal wiring structure. This extraction of unnecessary layers simplifies the manufacturing process, reduces material consumption, and lowers production costs while preserving complete electrical connectivity through optimized single-layer routing.
Solution Approach 2:
The patent changes the fundamental parameter of metal layer count from multiple layers to a single layer. This parameter change fundamentally alters the manufacturing complexity and cost structure, eliminating processes related to multiple metal deposition, etching, and alignment steps while maintaining functional electrical connectivity.
3Adaptability or versatility
If existing driver IC channels are used, then compatibility is maintained, but single-layer metal design requirements cannot be met
Solution Approach 1:
The patent makes the circuit layer design dynamic and adaptable by creating a flexible single-layer routing system that can accommodate various driver IC configurations. The trace and pad arrangement is designed to work with existing driver IC channel structures while adapting to the constraints of single-layer metal implementation.
Solution Approach 2:
The patent creates a universal single-layer circuit layer design that serves multiple functions: signal transmission, data routing, power distribution, and ground reference, all within a single metal layer. This multi-functional approach maintains compatibility with existing driver ICs while eliminating the need for multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables single-layer metal wiring with low cost and no short circuits between metal layers, meeting the requirements of mini LED displays by modifying the pin design of existing driver chips.
Implementation Method 1
a plurality of light emitting units disposed on the circuit layer
Implementation Method 2
configured to drive the plurality of light emitting units to emit light
Data Source
AI summary
A backlight source and a display device are provided. The display panel includes the plurality of stacked metal sub-layers and the first passivation sub-layer and the second passivation sub-layer stacked. The first passivation sub-layer is disposed between the metal layer and the second passivation layer. Material of the first passivation sub-layer includes silicon nitride. The first passivation sub-layer covers the untidy area at the ends of the molybdenum-titanium alloy thin layer to avoid from detachment of the passivation layer, and meanwhile to solve the issues of simplifying the manufacturing process of the display panel, and to avoid from oxidation of the bonding pads.