Single-Layer Removable Probe Card for Low-Leakage Testing
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Solution Overview
Problem
The increasing costs and inability of multi-layer substrates to handle low leakage currents in probe cards due to miniaturization of electronic elements in integrated circuit testing.
Innovation Solution
A removable probe card with a single-layer substrate and conductive traces on its surface, eliminating internal connections to reduce production costs and leakage current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer substrate is used in the probe card, then the signal transmission capability is improved, but the production cost increases and leakage current cannot be suppressed
Solution Approach 1:
The patent extracts the conductive traces from the interior of the substrate and places them only on the surface of the single-layer substrate. This eliminates the need for complex multi-layer internal routing while maintaining signal transmission functionality, thereby reducing production cost and suppressing leakage current.
Solution Approach 2:
Instead of embedding conductive traces within the substrate layers (conventional approach), the patent inverts the design by placing all conductive traces on the external surface of the substrate. This reversal simplifies manufacturing and reduces leakage while preserving signal transmission capability.
2Reliability
If a multi-layer substrate is used in the probe card, then the signal transmission capability is improved, but the leakage current increases
Solution Approach 1:
The patent extracts the conductive traces from the interior of the substrate and places them only on the surface of the single-layer substrate. This eliminates the need for complex multi-layer internal routing while maintaining signal transmission functionality, thereby reducing production cost and suppressing leakage current.
Solution Approach 2:
The patent employs a coating layer with porous or granular structure covering the conductive traces on the substrate surface. This coating structure provides electrical insulation while maintaining signal transmission capability, effectively suppressing leakage current without compromising reliability.
3Ease of operation
If the contacts of the test apparatus are larger than the contacts of the device under test, then the connection interface is simplified, but the probe card dimensions increase
Solution Approach 1:
The patent utilizes the surface plane of the single-layer substrate to arrange conductive traces in a two-dimensional layout, enabling space conversion functionality without increasing substrate thickness. This allows the probe card to accommodate both larger test apparatus contacts and smaller device under test contacts while maintaining compact dimensions.
Data Source
AI summary
The present disclosure provides a removable probe card including a circuit substrate, a single-layer substrate, multiple probes and multiple conductive traces. The circuit substrate includes multiple conductive pads. The single-layer substrate is disposed on the circuit substrate and exposes the conductive pads of the circuit substrate. A first surface of the single-layer substrate has a probe area and a trace area, and the probe area is surrounded by the trace area. The probes are disposed in the probe area on the single-layer substrate. The conductive traces are disposed in the trace area on the single-layer substrate, do not pass through a body of the single-layer substrate, and are configured to electrically connect the probes to the conductive pads, respectively.