Single Layer Substrate with Exposed Contact Pads for High Density Packaging
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Solution Overview
Problem
Conventional integrated circuit package technologies face challenges in reducing substrate size and increasing I/O density while maintaining electrical properties and cost-effectiveness, especially for small-sized electronic products.
Innovation Solution
A substrate with a single patterned metal layer and a patterned base, featuring exposed contact pads for both downward and upward electrical connections, and a simplified manufacturing process that reduces thickness and enhances mass production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-layer copper clad laminate structures are used, then electrical properties and structural strength are improved, but substrate thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and removes one of the two copper layers from the conventional two-layer CCL structure, retaining only a single copper layer. This extraction eliminates the need for complex multi-layer metallization while maintaining essential electrical connectivity through the simplified single-layer design with exposed contact pads on both surfaces.
Solution Approach 2:
The patent segments the electrical connection function by creating exposed contact pads on both the front and back surfaces of the substrate. This segmentation allows electrical connections to be established independently on each surface, eliminating the need for through-hole plating and complex internal trace routing, thereby reducing substrate thickness while maintaining electrical reliability.
2Reliability
If conventional two-layer copper clad laminate is used, then electrical connectivity is improved, but manufacturing process complexity and cost increase
Solution Approach 1:
The patent extracts the unnecessary second copper layer and associated complex manufacturing steps (through-hole drilling, plating, and metallization). By retaining only the single copper layer with exposed contact pads, the manufacturing process is simplified to basic lamination and cutting operations, significantly reducing process complexity and cost while maintaining electrical connectivity.
Solution Approach 2:
Instead of creating internal through-hole connections as in conventional designs, the patent inverts the approach by exposing contact pads on both external surfaces of the substrate. This inversion eliminates the need for complex internal routing and through-hole metallization, simplifying the manufacturing process while ensuring reliable electrical connectivity.
3Productivity
If I/O density is increased, then functional capability is improved, but trace pitch reduction becomes difficult and manufacturing precision requirements increase
Solution Approach 1:
The patent transitions from planar trace-based connectivity to three-dimensional surface mounting with exposed contact pads on both front and back surfaces. This dimensional change allows I/O connections to be established vertically and bidirectionally rather than relying solely on horizontal trace routing, dramatically increasing I/O density without requiring reduced trace pitch and avoiding stringent manufacturing precision requirements.
Data Source
AI summary
A substrate having single patterned metal layer includes a patterned base having at least a plurality of apertures, the patterned metal layer disposed on the patterned base, and a first surface finish layer. Parts of the lower surface of the patterned metal layer are exposed by the apertures of the patterned base to form a plurality of first contact pads for downward electrical connection externally, and parts of the upper surface of the patterned metal layer function as a plurality of second contact pads for upward electrical connection externally. The first surface finish layer is disposed at least on one or more surfaces of the second contact pads, and the first surface finish layer is wider than the second contact pad beneath. A package applied with the substrate disclosed herein further comprises at least a die conductively connected to the second contact pads of the substrate.