Single-Layer Timber Board Using Mixed Chip Sizes

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Solution Overview

Problem

Conventional three-layer chipboards require high energy and material consumption due to the need for small chips produced from round wood, leading to high bulk densities and increased production costs, while also being difficult to coat and handle.

Innovation Solution

A single-layer derived timber product board composed of 70-95% sliced chips and 5-30% crushed chips, with a bulk density below 500 kg/m3, allowing for easy coating and handling, produced using a method that includes mixing, gluing, and compressing the chips using a drum mixer and continuous press.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If three-layer construction with small chips is used in outer layers, then coatability is improved, but bulk density increases and energy consumption increases

Engineering Contradiction:

ImprovecoatabilityVSAvoidenergy consumption

Core Design Contradiction:

Ease of operationVSUse of energy by stationary object

Solution Approach 1:

The patent changes the chip size parameter in outer layers from small (conventional) to large (invention), which improves coatability while reducing energy consumption for chip production and lowering bulk density

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies different chip sizes to different layers: large chips in outer layers for coatability and smaller chips in the core layer for structural integrity, optimizing both coatability and energy efficiency locally

Inventive Principle:

Principle #3Local quality

2Shape

If small chips are used in outer layers, then continuous surfaces are produced, but material consumption increases and bulk density increases

Engineering Contradiction:

Improvesurface continuityVSAvoidmaterial consumption

Core Design Contradiction:

ShapeVSQuantity of substance

Solution Approach 1:

The patent changes the chip size parameter in outer layers from small to large, achieving surface continuity with fewer materials and lower bulk density

Inventive Principle:

Principle #35Parameter changes

3Reliability

If high compression is applied to outer layers with small chips, then gluing is improved, but bulk density increases and weight increases

Engineering Contradiction:

Improvegluing qualityVSAvoidbulk density

Core Design Contradiction:

ReliabilityVSWeight of stationary object

Solution Approach 1:

The patent changes the chip size parameter to large chips in outer layers, which improves gluing quality while requiring lower compression forces, thereby reducing bulk density and weight

Inventive Principle:

Principle #35Parameter changes

4Ease of operation

If three-layer board construction is used, then coatability is ensured, but production complexity increases and machine usage increases

Engineering Contradiction:

ImprovecoatabilityVSAvoidproduction complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent merges the outer layer and core layer into a single-layer construction with zones of different chip sizes, simplifying production while maintaining coatability through large chips in the outer regions

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9044876B2Light derived timber product board

Publication Date: 2015.06.02 KRONOPLYUS TEKHNIKAL AG

AI summary

The invention relates to a light, single-layer derived timber product board which is distinguished by having a bulk density of below 500 kg/m3 and consisting of a mixture of crushed and sliced chips. Furthermore, the invention relates to a method for the production of such a light, single-layer derived timber product board.