Single-Layer Welding Strip Carrier Film for Delamination-Free Lamination
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Solution Overview
Problem
The existing bonding films for no-main-grid solar cell modules with multiple layers are prone to delamination during high-temperature encapsulation and increase production costs, affecting transmittance, refractive index, and haze.
Innovation Solution
A single-layer welding strip carrier film with a raw material formula comprising 50-99% matrix resin, 0-50% tackifying resin, and 0-5% additives, optimized for bonding performance and compatibility with encapsulation films, featuring a smooth surface for the welding strip and a roughened surface for release, with options for cross-linking and embossing to enhance stability and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a multi-layer bonding film structure is used to provide bonding force for laminating with welding strip and cell, then bonding capability is improved, but the film is prone to delamination during high-temperature encapsulation and has higher production cost
Solution Approach 1:
The patent combines the support layer and bonding layer into a single integrated layer with dual functionality. This single layer provides both mechanical support and bonding capability through its composite resin composition (polyolefin + polyester + rubber elastomer), eliminating the interface between layers that causes delamination while maintaining bonding strength.
Solution Approach 2:
The patent uses a composite resin system combining polyolefin, polyester, and rubber elastomer in specific proportions. This composite material provides both the mechanical strength needed for support and the adhesion properties needed for bonding, replacing the multi-layer structure with a single composite layer that achieves both functions.
2Strength
If a multi-layer bonding film structure is used to provide bonding force, then bonding capability is improved, but transmittance, refractive index and haze are adversely affected
Solution Approach 1:
The patent merges support and bonding functions into one layer, reducing the total number of interfaces and material layers. This reduces light scattering at interfaces and minimizes the cumulative effect of multiple materials on optical properties, thereby improving transmittance and reducing haze compared to multi-layer structures.
3Strength
If a multi-layer bonding film structure is used, then bonding capability is improved, but processing cost and equipment cost increase
Solution Approach 1:
The patent combines multiple layers into a single layer, simplifying the manufacturing process. Instead of producing, handling, and laminating multiple separate layers, the single-layer structure requires only one extrusion or coating process, reducing processing steps, equipment requirements, and overall manufacturing cost.
4Device complexity
If a single-layer film structure is used to simplify the structure, then production cost is reduced, but bonding capability and resistance to delamination may be compromised
Solution Approach 1:
The patent achieves both simplicity and reliability by using a composite resin system within the single layer. The combination of polyolefin, polyester, and rubber elastomer in specific ratios provides both mechanical strength and adhesion, enabling the single layer to perform both support and bonding functions reliably without delamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and efficient bonding of the welding strip to the cell, reducing production costs and equipment costs while maintaining high transmittance and compatibility with encapsulation films, facilitating quick and stable lamination of photovoltaic modules.
Implementation Method 1
the bonding layer provides the bonding force required to laminate the bonding film with the welding strip and the bonding force required to laminate the bonding film with the cell
Implementation Method 2
using cross-linking or non-cross-linking methods to enhance adhesion and resistance
Data Source
AI summary
A welding strip carrier film. The raw materials for the welding strip carrier film comprise, in percent by mass, 50-99% of a matrix resin, 0-50% of a tackifying resin, and 0-5% of an additive. The matrix resin is one or more of a polyolefin resin and an elastomer thereof, a polyester resin and an elastomer thereof, polyvinyl butyral, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, polyamide, fluororesin, and modifiers thereof. The tackifying resin is one or more of rosin, hydrogenated rosin, a petroleum resin, a hydrogenated petroleum resin, a phenolic resin, and a terpene resin. The carrier film can be manufactured into a single-layer structure, and thus can have a support function while ensuring its bonding performance to a welding strip and a cell; and the carrier film would not be penetrated by a welding strip during lamination.