Single Lead Frame Semiconductor Device with Groove Shielding
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Solution Overview
Problem
Existing semiconductor devices with high-frequency circuits face challenges in reducing mounting area and optimizing lead frame material utilization, as they either have protruding metal cases that increase the mounting area or require assembly of two lead frames, leading to inefficiencies.
Innovation Solution
A semiconductor device design featuring a single lead frame with a groove portion, where the semiconductor element and terminals are arranged to be covered by a mold material, eliminating the need for external protrusions and reducing the assembly complexity of lead frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal case is provided for electromagnetic shielding, then electromagnetic wave radiation is suppressed, but the mounting area is increased due to protruding outer leads
Solution Approach 1:
The patent combines the electromagnetic shielding function with the lead frame structure itself by integrating ground terminals into the lead frame that extend along the outer circumference, eliminating the need for a separate metal case while maintaining shielding effectiveness and reducing mounting area
2Object-affected harmful factors
If two lead frames are overlaid and fixed to each other for shielding, then signal blocking is improved, but the utilization efficiency of lead frame material is decreased
Solution Approach 1:
The patent merges the functions of multiple lead frames into a single integrated lead frame structure that includes both signal terminals and ground terminals, eliminating the need for assembly of two separate lead frames while maintaining signal blocking capability and improving material utilization efficiency
3Ease of operation
If outer leads protrude from the metal case, then connection to external circuits is enabled, but the protruding portion cannot be electromagnetically shielded
Solution Approach 1:
The patent transitions from a three-dimensional metal case structure to a two-dimensional planar lead frame structure where ground terminals extend along the outer circumference, providing electromagnetic shielding in the plane of the mounting surface while maintaining external circuit connectivity
Data Source
AI summary
A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.