Single Lens for Photonic Integrated Circuits
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Solution Overview
Problem
Traditional multi-element lens systems used in photonic integrated circuits (PICs) are complex and costly, making them unsuitable for high-volume, low-cost mass production, especially for applications requiring simpler manufacturability and off-axis optical performance.
Innovation Solution
The use of a single lens with tailored emission properties or a combination of a macrolens and microlens to partially or completely correct for optical aberrations, allowing for the simplification of the optical lens system by shaping the light emission from the PIC or its combination with a microlens, thereby eliminating the need for complex multi-element lenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional multi-element lens system is used to control light emission from a PIC, then optical performance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the PIC emission surface with a single lens element by directly coupling the lens to the PIC facet. The lens is positioned in intimate contact with the emitting surface, merging the light source and optical element into a unified structure that eliminates the need for separate multi-element lens assemblies while maintaining optical performance.
Solution Approach 2:
The patent applies local quality by tailoring the emission properties of the PIC surface itself through microlens integration or surface shaping. The emission characteristics are optimized locally at the PIC-lens interface to compensate for optical aberrations, allowing a single simple lens to achieve performance previously requiring complex multi-element systems.
2Reliability
If a traditional multi-element lens system is used to control light emission from a PIC, then optical performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the PIC and lens into a single integrated unit that can be manufactured together using standard semiconductor fabrication processes. The lens is formed directly on or in contact with the PIC facet, enabling mass production through wafer-level processing rather than assembly of multiple discrete optical components, thereby dramatically reducing manufacturing cost.
Solution Approach 2:
The patent replaces expensive, precision-aligned multi-element lens assemblies with a single, simple lens element that can be manufactured at low cost using standard fabrication techniques. The simplified lens design accepts greater tolerances and can be produced in high volumes through economical processes, making the overall system more cost-effective despite reduced individual component precision.
3Reliability
If a traditional multi-element lens system is used to control light emission from a PIC, then optical performance is improved, but alignment complexity increases
Solution Approach 1:
The patent merges the light source and optical element into a single integrated unit where the lens is directly coupled to the PIC facet. This integration eliminates the need for separate alignment procedures between multiple components, as the lens and source are positioned together during fabrication. The unified structure inherently maintains proper alignment without requiring complex adjustment mechanisms or precision assembly procedures.
4Device complexity
If a single lens is used with tailored emission properties, then device complexity is reduced, but optical correction capability decreases
Solution Approach 1:
The patent applies local quality by modifying the emission properties of the PIC surface itself through integrated microlenses or surface shaping. These local modifications create tailored emission patterns that pre-correct for optical aberrations before light enters the main lens. This local correction mechanism enables a single simple lens to achieve optical performance that would otherwise require complex multi-element systems.
Solution Approach 2:
The patent implements preliminary action by shaping the light emission from the PIC surface before it enters the main lens. Microlenses or surface structures are integrated into the PIC to pre-form and pre-correct the light beams, preparing them in advance for transmission through the simple lens. This preliminary correction reduces the burden on the main lens, allowing it to be simpler while still achieving diffraction-limited performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-optimized, manufacturable optical lens system that achieves diffraction-limited performance with reduced complexity and cost, suitable for high-performance applications, including beam scanning and off-axis operations.
Implementation Method 1
a simplified traditional lens plus a microlens ('macrolens plus microlens') coupled to a PIC with tailored emission properties
Implementation Method 2
These implementations take advantage of the ability to carefully shape the way in which light is emitted by the PIC
Data Source
AI summary
An optical system is provided including a photonic integrated circuit and an optical lens system. The photonic integrated circuit includes an emission interface surface and a spatial array of apertures. The spatial array of apertures has a high numerical aperture (NA) of greater than 0.2 and includes a plurality of apertures spatially distributed across the interface surface. The optical lens system interfaces the photonic integrated circuit with free space by: receiving emitted light from the spatial array of apertures and altering a trajectory of the emitted light into the free space and receiving returning light from the free space and altering a trajectory of the returning light, such that the returning light is received by the spatial array of apertures.