Single Metal Layer Interposer for Low-Profile IC Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing interposer substrates in integrated circuit packaging are complex and costly, particularly due to the need for routability of inputs and outputs, which complicates the production of laminate interposers and substrates, hindering the development of smaller, more efficient semiconductor chip packages.
Innovation Solution
A method involving a base substrate with an integrated circuit die and vertical interconnects, where a single metal layer interposer is formed with a dielectric layer and routing pattern, allowing for coplanar interposer contacts and traces, and mounted on the vertical interconnects, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a laminate interposer with multiple metal layers is used to achieve routability of inputs and outputs, then the routing capability is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the essential routing function from complex multi-layer laminate interposers and implements it using a single metal layer with strategic via holes and trace routing. This extraction maintains the necessary routing capability while eliminating the complexity of multiple metal layers, dielectric layers, and associated manufacturing processes.
Solution Approach 2:
The patent employs a simpler, more cost-effective interposer structure that uses a single metal layer instead of expensive multi-layer laminates. This approach sacrifices some routing versatility but maintains sufficient functionality for the application, thereby reducing manufacturing complexity and cost.
2Adaptability or versatility
If a laminate interposer is used to provide routing patterns, then the routing functionality is improved, but the package height increases
Solution Approach 1:
The patent extracts the routing functionality from thick multi-layer laminate structures and implements it in a single metal layer, thereby maintaining routing capability while significantly reducing the vertical space required and thus the overall package height.
3Ease of manufacture
If a single metal layer interposer is used to reduce manufacturing complexity, then the ease of manufacture is improved, but the routing capability for high I/O signals may be insufficient
Solution Approach 1:
The patent uses a single metal layer with strategically placed via holes and traces to provide partial routing capability that is sufficient for the application's needs. This partial action approach maintains ease of manufacture while providing adequate routing functionality without the excessive complexity of full multi-layer structures.
Data Source
AI summary
An integrated circuit packaging system and method of manufacture thereof including: a base substrate; an integrated circuit die on the base substrate; vertical interconnects attached to the base substrate around the integrated circuit die; and a single metal layer interposer mounted on the vertical interconnects, the single metal layer interposer including: a routing pattern having interposer contacts and traces, and a dielectric layer on the interposer contacts and traces, a top surface of the interposer contacts coplanar with a top surface of the dielectric layer.