Single Metal Layer Adhesive and Diffusion Barrier
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Solution Overview
Problem
Existing device joining methods require additional adhesive layers and diffusion barriers, which increase complexity and cost, and can lead to degradation due to unwanted species diffusion between components.
Innovation Solution
A device with a single metal layer functioning as both an adhesive and diffusion barrier, part of a multi-phase connecting element, eliminating the need for additional layers and simplifying the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional adhesive layers and diffusion barriers are used to join components, then the reliability of preventing unwanted species diffusion is improved, but the device complexity increases
Solution Approach 1:
The patent combines the adhesive layer and diffusion barrier into a single integrated layer made of the same material. This merging eliminates the need for separate layers while maintaining both adhesive bonding functionality and diffusion prevention, thereby reducing device complexity without compromising reliability.
Solution Approach 2:
The single layer is designed to perform multiple functions simultaneously: it acts as an adhesive layer for bonding components together and as a diffusion barrier to prevent unwanted species diffusion. This multi-functionality reduces the total number of layers needed in the device structure.
2Reliability
If additional adhesive layers and diffusion barriers are used to join components, then the reliability of preventing unwanted species diffusion is improved, but the manufacturing cost increases
Solution Approach 1:
By merging the adhesive layer and diffusion barrier into a single layer, the patent reduces the number of deposition steps and material applications required during manufacturing. This simplification directly lowers manufacturing costs while maintaining the reliability of preventing unwanted species diffusion.
Solution Approach 2:
The single multi-functional layer reduces material costs and processing steps compared to using separate adhesive and barrier layers, thereby improving ease of manufacture while maintaining the required reliability for preventing diffusion.
3Device complexity
If a single metal layer is used as both adhesive and diffusion barrier, then the device complexity is reduced, but the reliability of preventing unwanted species diffusion may be compromised
Solution Approach 1:
The patent merges the adhesive and diffusion barrier functions into a single layer, reducing device complexity. The reliability of diffusion prevention is maintained through careful selection of the layer material and optimization of its thickness to ensure adequate barrier performance.
Solution Approach 2:
The patent optimizes parameters such as layer thickness and material composition to ensure that the single layer provides sufficient diffusion barrier performance. By adjusting these parameters, the reliability of preventing unwanted species diffusion is maintained even with the reduced structure.
4Ease of manufacture
If a single metal layer is used as both adhesive and diffusion barrier, then the ease of manufacture is improved, but the functional integrity may be compromised
Solution Approach 1:
The single layer is designed to perform both adhesive bonding and diffusion barrier functions simultaneously. The material selection and layer design ensure that both functions are fulfilled effectively, maintaining functional integrity while simplifying the manufacturing process.
Solution Approach 2:
The patent optimizes layer thickness and material properties to ensure that the single layer maintains adequate adhesive strength and diffusion barrier performance. These parameter adjustments ensure functional integrity is preserved despite the simplified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The single metal layer effectively connects components while preventing unwanted diffusion, reducing device complexity and maintaining functional integrity by acting as both an adhesive and diffusion barrier.
Implementation Method 1
The first metal is formed as a diffusion barrier. The diffusion barrier is arranged between the adhesive layer and the first and/or second component.
Implementation Method 2
The first and/or second phase comprises further metals in addition to the first metal... The concentration of the first metal in the first phase is greater than the concentration of the first metal in the second phase
Implementation Method 3
The connecting element comprises at least a first phase and a second phase... The first and/or second phase comprises further metals in addition to the first metal
Data Source
AI summary
A device and a method for producing a device are disclosed. In an embodiment the device includes a first component, a second component and a connecting element directly arranged between the first component and the second component, wherein the connecting element includes at least a first metal, which is formed as an adhesive layer, a diffusion barrier and a component of a first phase and a second phase of the connecting element, wherein the adhesive layer is arranged on the first component and/or the second component, wherein the first phase and/or the second phase includes, besides the first metal, further metals different from the first metal, wherein a concentration of the first metal in the first phase is greater than a concentration of the first metal in the second phase, and wherein the connecting element includes a layer of a silicide of the first metal.