Single-Package SSD Layout With Shorter PCB Signal Traces
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Solution Overview
Problem
The increasing complexity and cost of manufacturing higher capacity and faster solid-state drives (SSDs) due to the need for additional layers and complex trace routing, as well as the separate testing and reliability issues with ball grid arrays (BGAs) and solder balls, hinder the development of efficient data storage devices.
Innovation Solution
A data storage device design where the controller, memory devices, and passive components are integrated within a single package, directly mounted to a printed circuit board (PCB) without BGAs, with improved layout for shorter signal paths and encapsulated by a molding compound, using a reflow soldering process for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If additional layers and complex trace routing are added to accommodate higher capacity memory devices, then storage capacity increases, but manufacturing complexity and cost increase
Solution Approach 1:
The patent transitions from traditional multi-layer PCB architecture to a single-layer PCB design by integrating controller and memory devices directly on the PCB surface. This dimensional reorganization eliminates the need for complex vertical trace routing through multiple layers, achieving high storage capacity without proportional increases in manufacturing complexity
Solution Approach 2:
The patent merges the controller device and memory devices into a single integrated package mounted on the PCB. By combining these components that were traditionally separate, the design eliminates intermediate connection layers and simplifies the overall manufacturing process while maintaining high storage capacity
2Reliability
If ball grid arrays and solder balls are used for mounting components, then component connectivity is achieved, but reliability decreases due to solder voiding risks
Solution Approach 1:
The patent extracts and eliminates the ball grid array and solder ball connection method from the design. By removing this intermediate connection layer entirely and implementing direct mounting of controller and memory devices to the PCB, the harmful effect of solder voiding is eliminated while maintaining reliable component connectivity
Solution Approach 2:
The patent removes the solder ball intermediary between components and PCB. By establishing direct mechanical and electrical contact through surface mounting, the design eliminates the solder joint intermediary that introduces reliability risks through voiding, achieving more dependable connections
3Speed
If controller and memory devices are mounted separately on PCB, then component testing is simplified, but signal transmission paths become longer reducing read/write speeds
Solution Approach 1:
The patent merges the controller and memory devices into a single integrated package that is mounted as one unit on the PCB. This integration dramatically shortens the signal transmission paths between controller and memory, boosting read/write speeds while the unified package structure actually simplifies assembly and testing procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing complexity and cost, enhances read/write speeds, lowers resistance and operating temperature, and improves signal transmission, while eliminating the need for separate testing and reducing the risk of solder voiding.
Implementation Method 1
A molding compound is used to encapsulate the controller, the one or more memory devices and the one or more passive components
Implementation Method 2
A reflow soldering process is performed to secure the controller and the one or more passive components to the surface of the PCB
Data Source
AI summary
A data storage device includes a controller, one or more memory devices and one or more passive components encapsulated in a single package. The controller, the memory devices and the passive components are directly mounted to a printed circuit board (PCB) of the data storage device. A position of the controller with respect to the one or more memory devices enables the data storage device to use shorter signal traces. Shorter signal traces leads to improved read and/or write speeds of the data storage device along with other benefits.