Single-PCB Camera Structure for Thermal and Alignment Stability
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Solution Overview
Problem
Cameras with stacked printed circuit board (PCB) architecture face issues with thermal efficiency, alignment, and electrical performance in autonomous vehicle applications, including inefficient heat dissipation, misalignment due to lack of integrated mount points, and signal integrity loss through interconnects.
Innovation Solution
A camera design featuring a single PCB architecture with integrated mounting holes, alignment holes, and heat conducting channels, eliminating the need for interconnects and custom brackets, and enhancing thermal dissipation and alignment stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a stacked PCB architecture is used, then the camera can be compact, but thermal efficiency deteriorates due to inefficient heat dissipation
Solution Approach 1:
The patent merges multiple PCB layers into a single integrated PCB structure with integrated mounting holes and heat conducting channels. This consolidation eliminates the thermal barriers between stacked PCBs while maintaining compact form factor, directly resolving the contradiction between compact size and heat dissipation efficiency.
Solution Approach 2:
The patent introduces heat conducting channels as intermediary thermal pathways within the single PCB structure. These channels act as thermal mediators that efficiently conduct heat away from sensitive components, improving thermal efficiency without increasing camera volume.
2Reliability
If stacked PCB architecture with interconnects is used, then electrical connections can be established, but signal integrity deteriorates due to signal loss through interconnects
Solution Approach 1:
The patent combines multiple PCB functions into a single PCB architecture, eliminating interconnects between stacked PCBs. This integration maintains reliable electrical connections while preventing signal integrity loss that occurs through interconnect pathways, directly resolving the contradiction between electrical connection reliability and signal integrity.
3Adaptability or versatility
If custom brackets are used for mounting, then camera installation is flexible, but alignment stability deteriorates due to lack of integrated mount points
Solution Approach 1:
The patent integrates mounting holes directly into the PCB structure, combining the camera body and mounting interface into a single unified component. This integration eliminates the need for separate custom brackets, maintaining installation flexibility while dramatically improving alignment stability through rigid, built-in mounting points.
4Adaptability or versatility
If multiple separate components are used, then device functionality is comprehensive, but device complexity increases
Solution Approach 1:
The patent merges multiple separate components (PCB layers, mounting brackets, heat sinks) into a single integrated PCB structure that maintains all necessary functionalities. This consolidation reduces structural complexity while preserving comprehensive device functionality, directly resolving the contradiction between adaptability and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal efficiency, ensures secure and stable camera alignment, and maintains signal integrity by eliminating the need for interconnects and custom brackets, leading to better performance in autonomous vehicle applications.
Implementation Method 1
heat conducting channels
Data Source
AI summary
A sensor device includes a housing. The housing includes a front plate and a back plate, and a printed circuit board encased by the housing. The printed circuit board includes an image sensor, an image sensor processor, and conducting layers interposed between insulating layers. A conducting layer of the conducting layers includes power planes. One of the power planes is connected to a decoupling capacitor that carries power to the image sensor or the image sensor processor.