Single PCB Camera for Autonomous Vehicles with Thermal Vias

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Solution Overview

Problem

Cameras used in autonomous applications, such as autonomous vehicles, face issues with thermal conductivity, mechanical stability, and signal integrity due to stacked printed circuit board (PCB) architectures, which compromise heat dissipation, alignment, and electrical performance.

Innovation Solution

A camera design featuring a single PCB architecture with a camera housing that includes mounting holes, alignment holes, and thermal vias for improved mechanical stability and heat dissipation, eliminating the need for interconnects and custom brackets, and enhancing signal integrity by integrating these features directly into the camera housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a stacked PCB architecture is used, then the camera can accommodate multiple components, but thermal conductivity deteriorates due to compromised heat dissipation

Engineering Contradiction:

Improvecomponent accommodationVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent merges multiple PCB layers into a single PCB structure, integrating image sensor, image sensor processor, and serializer components onto one board. This eliminates the thermal barriers between stacked PCBs while maintaining component accommodation through integrated circuit design and single-board integration.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If a stacked PCB architecture is used, then component integration is achieved, but mechanical stability deteriorates due to alignment issues

Engineering Contradiction:

Improvecomponent integrationVSAvoidalignment

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent combines multiple aligned components (image sensor, processor, serializer) onto a single PCB with integrated mounting features. The single PCB structure eliminates alignment errors between stacked boards, while component integration is achieved through integrated circuit mounting and unified structural support.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If a stacked PCB architecture is used, then multiple functional layers are achieved, but signal integrity deteriorates due to interconnect requirements

Engineering Contradiction:

Improvefunctional layersVSAvoidsignal integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent consolidates multiple functional layers into a single PCB architecture, eliminating inter-PCB interconnects and custom brackets. All components (image sensor, processor, serializer) are mounted on one board, reducing signal path complexity and improving signal integrity through direct trace connections without external connectors.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If a single PCB architecture is used, then signal integrity is improved by eliminating interconnects, but device complexity must be managed

Engineering Contradiction:

Improvesignal integrityVSAvoidintegration complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple components and functional layers into a single PCB design, simplifying the overall device structure. While integration complexity increases during design, the final assembled device has reduced mechanical complexity with fewer parts (no interconnects, no custom brackets), improving reliability and ease of assembly.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced thermal conductivity, mechanical stability, and signal integrity, allowing for secure and aligned camera installation on autonomous vehicle structures, improving camera performance and reliability.

Implementation Method 1

The one or more exposed surfaces may transfer heat generated by the image sensor, the image sensor processor, and the serializer from the printed circuit board to the housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the plurality of heat conducting channels are disposed underneath the image sensor, the image sensor processor, and the serializer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11832379B2Single PCB board camera with enhanced signal integrity and thermal conduction

Publication Date: 2023.11.28 PONY AI INC

AI summary

Described herein is a sensor device. The sensor device comprises a housing and a printed circuit board encased by the housing. The printed circuit board comprises an image sensor that captures image data, an image sensor processor that processes the image data, a serializer that converts one or more data channels associated with the image data into a single data channel, and one or more exposed surfaces. The one or more exposed surfaces dissipate heat generated by the image sensor, the image sensor processor, and the serializer from the printed circuit board to the housing.