Single-Shot Die Encapsulation for Thinner Semiconductor Packaging
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Solution Overview
Problem
Current semiconductor manufacturing processes are inefficient and environmentally unfriendly, requiring multiple steps and materials, which increases costs and time to market while also resulting in larger device footprints and parasitic characteristics.
Innovation Solution
The implementation of a single-shot encapsulation method for semiconductor devices, which involves forming low-profile bumps and redistribution layers, and then using a single encapsulant to package semiconductor die without a base leadframe, allowing for reduced package thickness and simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional multi-step encapsulation processes are used, then manufacturing precision and reliability can be maintained, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines multiple encapsulation steps into a single shot encapsulation process. The encapsulant is applied in one step to form a single-layer encapsulation structure that performs multiple functions (protection, insulation, mechanical support) simultaneously, eliminating the need for sequential application of multiple encapsulation layers and reducing process complexity while maintaining protective functions.
Solution Approach 2:
The single shot encapsulation structure serves multiple functions: it provides mechanical protection to the semiconductor die, electrical insulation between conductive elements, structural support for the package, and environmental sealing. This multi-functional design replaces what would traditionally require multiple specialized layers, improving manufacturing efficiency without sacrificing reliability.
2Volume of moving object
If traditional encapsulation with base leadframe is used, then structural support is provided, but package thickness and footprint increase
Solution Approach 1:
The patent extracts and eliminates the base leadframe from the traditional encapsulation structure. By removing this unnecessary component, the package thickness and footprint are significantly reduced. The semiconductor die is directly mounted on the substrate with the encapsulant providing protection without the intermediate leadframe layer, achieving compact packaging while maintaining structural integrity through alternative support mechanisms.
Solution Approach 2:
The encapsulant is applied as a thin film or molding compound that provides sufficient structural support and protection without adding significant thickness. The encapsulation layer is optimized to be minimal while still performing its protective and supportive functions, enabling reduced package size without compromising structural strength.
3Reliability
If multiple encapsulation steps are performed, then comprehensive protection is achieved, but manufacturing time and cost increase
Solution Approach 1:
Multiple encapsulation operations are merged into a single shot process where the encapsulant is applied in one continuous step. This single operation provides comprehensive protection equivalent to multiple sequential steps, significantly reducing manufacturing cycle time and cost while maintaining the same level of protective coverage and reliability.
Solution Approach 2:
The encapsulation process is designed to perform all necessary protective functions in advance during the single shot application. The encapsulant formulation and application process are optimized to provide complete protection (mechanical, electrical, environmental) in one step, eliminating the need for subsequent encapsulation steps and reducing overall manufacturing time.
4Object-affected harmful factors
If conventional packaging materials and methods are used, then adequate protection is provided, but environmental impact increases
Solution Approach 1:
The patent changes the parameters of the encapsulation process by using a single shot application method that reduces material consumption. The encapsulant is applied more efficiently with less waste, and the process eliminates the need for multiple materials that would be used in traditional multi-step encapsulation. This parameter change in the manufacturing process reduces environmental impact while maintaining adequate protective coverage.
Solution Approach 2:
The single shot encapsulation process eliminates excess material waste that occurs in multi-step processes. By applying the encapsulant in one precise operation, over-application and material waste are minimized. The process also eliminates the need to discard and replace multiple encapsulation layers, reducing material waste and environmental impact while providing equivalent protection.
Data Source
AI summary
A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.