Single-Sided Electronic Module with Printed Conductive Tracks
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Solution Overview
Problem
The high cost and inflexibility of existing double-sided electronic modules, which require two metallized layers, make them expensive for mass production and not adaptable to different integrated circuit chip configurations.
Innovation Solution
A single-sided electronic module is produced using a dielectric film with conductive tracks printed on one face, allowing for direct connection to a semiconductor component via conductive wire or interconnection pads, reducing material usage and enabling adaptation to various chip configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a double-sided module with two metallized layers is used, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the second metallized layer from the double-sided module structure, retaining only the first metallized layer with contact pads. Electrical connections are achieved by bonding wires directly to the contact pads without requiring a second metallized layer, thereby reducing material cost while maintaining connection reliability.
Solution Approach 2:
The first metallized layer serves multiple functions: it provides both the contact pads for wire bonding and the conductive paths for electrical connections. This multi-functionality eliminates the need for a separate second metallized layer, reducing manufacturing complexity and cost.
2Ease of manufacture
If a single metallized layer is used, then manufacturing cost is reduced, but adaptability to different chip configurations is worsened
Solution Approach 1:
The first metallized layer is segmented into multiple discrete contact pads arranged in specific patterns. Different pad configurations can be designed to match different chip types, allowing a single metallized layer structure to adapt to various integrated circuit chip configurations through appropriate pad layout design.
3Reliability
If wire bonding is used to connect chip pads to contact pads, then electrical connection is improved, but manufacturing complexity increases
Solution Approach 1:
The contact pads are designed with self-aligning features that automatically position themselves relative to the chip pads during bonding. The metallized layer structure itself provides the bonding surface and electrical path, eliminating the need for additional alignment fixtures or complex bonding equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly lowers production costs and allows for module personalization, making it more economical and adaptable to different electronic component configurations while maintaining reliable electrical connections.
Implementation Method 1
the tracks are printed on the face of the dielectric film by a printing process
Data Source
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AI summary
The invention relates to an electronic module (10) comprising a dielectric support film (11) having a first side, conductor paths (20) that are printed on said first side, and a semiconductor component (15) which connects the conductor paths by means of electrical connections. The electronic module (10) of the invention is characterized in that each electrical connection includes a lead wire (19, 24) that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad (17).