Single-Sided Semiconductor Package with Reverse Build-Up Hybrid Structure
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Solution Overview
Problem
Conventional semiconductor packaging techniques require multiple stages of processing, including flipping and attaching to a second carrier, which increases manufacturing costs and risks of damage, leading to yield loss.
Innovation Solution
A semiconductor device is manufactured using a single temporary carrier with processing on only one side, featuring a semiconductor die attached to a redistribution structure and encapsulated by a molded material, with conductive columns extending through the molded material to facilitate electrical coupling and structural support, allowing for a single-sided manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple stages of processing including flipping and attaching to a second carrier are used, then the semiconductor device can be packaged and protected, but the manufacturing cost increases and the risk of damage increases leading to yield loss
Solution Approach 1:
The patent applies preliminary action by forming the redistribution layer on the carrier substrate before mounting the semiconductor dies. This allows the RDL to be pre-configured with proper alignment features, eliminating the need for subsequent flipping and re-attachment operations. The RDL is prepared in advance on the same carrier that will hold the dies throughout processing, ensuring consistent alignment without additional handling steps.
Solution Approach 2:
The patent merges multiple processing operations into a single continuous process by maintaining all dies on one carrier substrate throughout manufacturing. The carrier serves simultaneously as the support structure, the RDL substrate, and the final package substrate. This consolidation eliminates the need for separate flipping and re-attachment stages, reducing both processing complexity and handling-induced damage.
2Reliability
If multiple stages of processing are used, then the semiconductor device can be packaged and protected, but the manufacturing cost increases
Solution Approach 1:
The encapsulant material is applied in advance to form a mold cavity that will eventually enclose the semiconductor dies. This preliminary formation of the protective structure allows subsequent steps to proceed without additional handling of the dies. The mold cavity is prepared on the carrier before die attachment, enabling a continuous single-sided processing flow that reduces manufacturing cost.
Solution Approach 2:
The carrier substrate serves as an intermediary that supports all processing operations. It functions as the RDL substrate, the die mounting platform, and the final package body. This single intermediary structure eliminates the need for multiple carrier transfers and reduces manufacturing complexity, thereby lowering costs while maintaining package protection.
3Ease of manufacture
If conventional packaging techniques are used with multiple stages, then the bond pads can be coupled to external terminals, but the risk of damage during manufacturing increases
Solution Approach 1:
The redistribution layer is formed in advance on the carrier with pre-defined connection paths to the bond pads. This preliminary configuration ensures that electrical coupling is established before any die handling occurs. The RDL traces and vias are pre-aligned with the bond pad locations, eliminating the need for subsequent alignment operations that would require flipping and re-attachment.
Solution Approach 2:
The patent combines the RDL formation, die mounting, and electrical coupling operations into a single continuous process on one carrier. The RDL is formed directly on the carrier, dies are mounted on the same carrier, and electrical connections are made in situ without removing or flipping the dies. This merging of operations eliminates handling steps that cause damage while maintaining electrical coupling functionality.
Data Source
AI summary
Semiconductor devices having a semiconductor die electrically coupled to a redistribution structure and a molded material over the redistribution structure are disclosed herein, along with associated systems and methods. In one embodiment, a semiconductor device includes a semiconductor die attached to a first side of a substrate-free redistribution structure, and a plurality of conductive columns extending through a molded material disposed on the first side of the redistribution structure. The semiconductor device can also include a second redistribution structure on the molded material and electrically coupled to the conductive columns. A semiconductor device can be manufactured using a single carrier and requiring processing on only a single side of the semiconductor device.