Glass Core Package Substrates With Single-Step TGV and Component Cavities
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Solution Overview
Problem
The challenge in developing package substrates for IC chips and semiconductor dies is to provide stable transmission of high-frequency data signals and increased power delivery, while addressing the mechanical and fabrication limitations of glass cores, such as fragility and the need for specialized etching processes.
Innovation Solution
The implementation of glass core assemblies with through-glass vias (TGVs) and cavities for electronic components, fabricated using a single laser-induced deep etching (LIDE) process to create multiple openings concurrently, which avoids the negative impacts of multiple etching processes on the glass core's structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple etching processes are used to create TGVs and cavities separately, then each feature can be precisely formed, but the glass core's structural integrity deteriorates and stress increases
Solution Approach 1:
The patent combines the formation of through-glass vias (TGVs) and cavities for electronic components into a single laser-induced deep etching (LIDE) process. This merging of operations allows both features to be created concurrently in one step, eliminating the need for multiple separate etching processes that would compromise the glass core's structural integrity and introduce stress.
2Adaptability or versatility
If multiple separate etching processes are used for TGVs and cavities, then each feature can be independently controlled, but the fabrication process complexity increases
Solution Approach 1:
The patent merges the fabrication of TGVs and cavities into a single LIDE process step, reducing fabrication process complexity from multiple sequential etching operations to one concurrent process. The single process achieves what previously required multiple steps, thereby simplifying the overall manufacturing workflow while maintaining the ability to form both feature types.
3Ease of manufacture
If traditional substrate layers are used, then fabrication is simpler, but high-frequency data signal transmission stability and power delivery are insufficient
Solution Approach 1:
The patent transitions from traditional organic substrate layers to a glass core material, representing a fundamental parameter change in substrate composition. This material substitution provides superior mechanical support and electrical performance for high-frequency data signal transmission and power delivery, despite requiring specialized laser-based fabrication processes to work with the glass material.
4Reliability
If glass cores are used to improve signal transmission, then high-frequency data signal stability increases, but the glass becomes more fragile and requires specialized processing
Solution Approach 1:
The patent replaces traditional mechanical drilling or conventional etching methods with a laser-induced deep etching (LIDE) process for creating features in the glass core. This substitution of the fabrication mechanism allows precise formation of TGVs and cavities while minimizing mechanical stress and preserving the structural integrity of the fragile glass material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the simultaneous fabrication of TGVs and larger cavies for electronic components within a glass core, ensuring that the features do not affect each other, and reduces the stress on the glass core, thereby enhancing mechanical support and signal transmission while simplifying the fabrication process.
Implementation Method 1
fabricated using a single laser-induced deep etching (LIDE) process to create multiple openings concurrently
Data Source
AI summary
Package substrates with components included in cavities of glass cores are disclosed. An example apparatus includes: a glass layer having a first hole and a second hole, the second hole larger than an electronic component disposed therein, a width of the electronic component larger than a width of the first hole. The example apparatus further includes a conductive material that substantially fills the first hole; and a dielectric material that substantially fills a space within the second hole surrounding the electronic component.