Lithographic Inter-Die Links for Single-Substrate Multi-Die ICs

The patent merges multiple separate computer servers into a single integrated circuit device with multiple processing cores. This consolidation allows data to be processed in parallel across multiple cores within the same chip, dramatically increasing data processing speed while maintaining the scalability benefits of having multiple processing units. The inter-die connections enable efficient data sharing and communication between cores that would otherwise require slow off-chip communication.

The patent combines multiple processing die onto a single substrate, creating an integrated multi-core processor. This merging eliminates the need for off-chip communication between processing units, as all cores reside on the same physical chip and can communicate through fast on-chip interconnects. The result is high computational capability with minimal communication latency, as data can be shared and processed across cores without the delays inherent in separate chip architectures.

The patent performs preliminary alignment and positioning of multiple die on the substrate before forming the inter-die connections. By pre-positioning the die with high precision using advanced lithography techniques and alignment markers, the system ensures that subsequent connection formation (such as through-silicon vias or wire bonding) can be executed with the required precision. This preliminary action allows traditional manufacturing processes to achieve high-precision results that would otherwise require entirely new fabrication methodologies.