Single-Surface Coil Structure for Thin Inductor Reliability
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Solution Overview
Problem
The challenge in developing reduced-size coil electronic components is maintaining their properties and performance due to limitations in increasing the content of magnetic materials, especially in complex structures with multifunctionality and reduced thickness.
Innovation Solution
A coil electronic component design featuring a support substrate with a coil pattern on one surface, conductive vias connecting to external electrodes, and an encapsulant with magnetic grains and insulating resin, which includes a single-surface coil structure and lower surface electrodes to enhance relativity and inductor properties while reducing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the coil electronic component is reduced, then the component meets reduced size requirements, but the inductor properties and reliability deteriorate
Solution Approach 1:
The encapsulant is formulated as a composite material containing magnetic grains (20-80 wt%) dispersed in an insulating resin matrix. This composite structure provides both magnetic properties for inductor performance and insulating properties for electrical stability, allowing the component to maintain reliability while reduced in size. The composite nature enables optimization of both magnetic and insulating characteristics simultaneously.
Solution Approach 2:
The patent optimizes the thickness of the encapsulant (T1+T2) relative to the support substrate and coil pattern (T3), establishing specific thickness relationships (T1+T2 < T3 or T1+T2 ≈ T3) to maintain proper magnetic flux distribution and electrical insulation. This parameter optimization ensures that even in a reduced-size component, the inductor properties and reliability are preserved through controlled dimensional relationships.
2Reliability
If the content of magnetic material is increased to maintain inductor properties, then the magnetic performance improves, but the strength of the inductor body decreases and frequency properties change due to insulating property limitations
Solution Approach 1:
The encapsulant combines magnetic grains with insulating resin in optimized proportions (20-80 wt% magnetic grains) to achieve a balance between magnetic performance and mechanical strength. The insulating resin matrix provides structural support and strength, while the magnetic grains provide the necessary magnetic properties, resolving the trade-off between inductor performance and body strength.
Solution Approach 2:
The magnetic grains are distributed throughout the encapsulant volume rather than concentrated in one area, creating local magnetic fields that collectively provide the necessary inductor properties. This distributed arrangement maintains mechanical strength while achieving the required magnetic performance through localized magnetic effects throughout the encapsulant structure.
3Volume of moving object
If the thickness of the chip is reduced, then the reduced size requirement is met, but the structural stability and performance reliability are compromised
Solution Approach 1:
The encapsulant's composite structure of magnetic grains in an insulating resin provides both mechanical strength and magnetic functionality in a thin profile. This allows the chip thickness to be reduced while maintaining structural stability through the reinforced composite material that combines the structural properties of the resin with the functional properties of the magnetic grains.
Solution Approach 2:
The patent establishes specific thickness relationships between the encapsulant (T1+T2) and the support substrate with coil pattern (T3), where T1+T2 < T3 or T1+T2 ≈ T3. This parameter control ensures that even when overall chip thickness is reduced, the structural stability is maintained by preserving adequate thickness ratios between functional layers, preventing deformation while achieving size reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved reliability and inductor performance with reduced size, minimizing short defects and securing high performance even when mounted on substrates, by optimizing the thickness and structural stability of the component.
Implementation Method 1
an encapsulant encapsulating the support substrate and the coil pattern
Implementation Method 2
first and second conductive vias penetrating the support substrate and connected to one end and the other end of the coil pattern, respectively
Data Source
AI summary
A coil electronic component includes a support substrate having a first surface and a second surface opposing each other, a coil pattern disposed on the first surface of the support substrate, first and second conductive vias penetrating the support substrate and connected to one end and the other end of the coil pattern, respectively, an encapsulant encapsulating the support substrate and the coil pattern, and first and second external electrodes disposed on a lower surface of the encapsulant and electrically connected to the first and second conductive vias, respectively. The support substrate is disposed between the lower surface of the encapsulant and the coil pattern.