Single-Surface Image Sensing Layout for Side-Viewing Endoscopes
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Solution Overview
Problem
The size of conventional front-viewing endoscopes is difficult to reduce, limiting their applicability in minimally invasive medical procedures and industrial inspections.
Innovation Solution
A side-viewing endoscope design with an image sensing device comprising a substrate, connection wire, image module, and light source module, all disposed on the first surface of the substrate, allowing for compact arrangement and minimizing the overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a front-viewing endoscope design is used, then image capture functionality is achieved, but the endoscope size cannot be reduced
Solution Approach 1:
The patent inverts the conventional front-viewing endoscope design by implementing a side-viewing configuration. The image sensor and lens are positioned on the side wall of the insertion section rather than at the distal tip, allowing the endoscope to capture images from lateral directions. This inversion enables compact sizing while maintaining imaging functionality.
Solution Approach 2:
The patent transitions from a single-point front-viewing design to a multi-point side-viewing design by distributing multiple image sensors around the circumference of the insertion section. This dimensional change from one imaging location to multiple lateral positions enables both size reduction and comprehensive image capture capability.
2Volume of moving object
If connection components are arranged on both surfaces of the substrate, then electrical connections are achieved, but the overall device size increases
Solution Approach 1:
The patent merges the wire connection member, image module connection member, and light source module connection member onto a single surface of the substrate. This consolidation eliminates the need for separate connection layers on opposite surfaces, reducing the substrate thickness and overall device volume while maintaining all necessary electrical connections.
Solution Approach 2:
The substrate's first surface serves multiple functions by hosting all connection components (wire connection, image module connection, and light source module connection). This multi-functional arrangement on a single surface simplifies the overall structure and reduces the space required for connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the endoscope's size, enhancing its applicability in minimally invasive procedures and industrial inspections while maintaining image quality and functionality.
Implementation Method 1
The image module captures external images along a lateral-side direction, which is between two ends of the distal tip
Implementation Method 2
The light source module is electrically connected with the light source module connection member, projecting light along the lateral-side direction of the distal tip
Data Source
AI summary
An image sensing device for a side-view endoscope includes a substrate having a first surface, wherein a wire connection member, an image module connection member and a light source module connection member are disposed on the first surface, and wherein the wire connection member is electrically connected with the image module connection member and the light source module connection member; an image module electrically connected with the image module connection member and configured to capture external images along a lateral-side direction of a distal tip; and a light source module electrically connected with the light source module connection member, configured to project a light source along the lateral-side direction of the distal tip. By disposing the image module and the light source module on the same surface of the substrate, the device can be applied to side-view endoscopes and has the competitive advantage of miniaturization.


