Single-Wafer Spin Cleaner with Integrated Soaking and Etching
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Solution Overview
Problem
Conventional single wafer spin cleaning apparatuses lack the ability to perform a soaking process, requiring wafers to be transferred between multiple devices for soaking, cleaning, and etching, which complicates the process, increases time, and raises production costs.
Innovation Solution
A single wafer spin cleaning apparatus with a wafer support disk surrounding the wafer spin chuck, allowing for ascending and descending movements to facilitate soaking, cleaning, and etching on the same device, utilizing a lifting drive mechanism and a soaking trough to maintain a liquid level for effective soaking and discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional single wafer spin cleaning apparatus is used, then the cleaning process can be performed, but the apparatus cannot perform soaking process and requires transfer between multiple devices
Solution Approach 1:
The patent combines multiple cleaning functions (soaking, spin cleaning, and etching) into a single apparatus. The soaking tank is integrated with the spin cleaning chamber, allowing the wafer to undergo multiple cleaning steps without being transferred to separate devices, thereby reducing process complexity while maintaining functional versatility
Solution Approach 2:
The spin cleaning apparatus is designed to perform multiple functions: soaking in chemical solution, spin cleaning, and etching. The wafer support disk can accommodate the wafer in the soaking tank and then transfer it to the spin cleaning position, enabling one apparatus to replace multiple specialized devices
2Adaptability or versatility
If wafer is transferred between multiple devices for soaking, cleaning, and etching, then each process can be performed, but processing time increases
Solution Approach 1:
By merging the soaking tank and spin cleaning chamber into a single integrated apparatus with a shared wafer support disk, the patent eliminates transfer time between devices. The wafer remains on the same support disk throughout all cleaning steps, significantly reducing total processing time while maintaining all necessary cleaning functions
3Adaptability or versatility
If wafer is transferred between multiple devices, then cleaning processes can be completed, but production costs increase
Solution Approach 1:
The patent merges multiple cleaning devices into a single integrated apparatus, reducing the total number of devices required in the cleanroom. This consolidation lowers equipment acquisition costs, reduces maintenance requirements, and simplifies facility planning while preserving all essential cleaning functions
Solution Approach 2:
The spin cleaning apparatus is designed as a universal platform that can perform soaking, spin cleaning, and etching functions. This multi-functionality eliminates the need for separate specialized devices for each cleaning step, thereby reducing overall production costs while maintaining process versatility
4Adaptability or versatility
If wafer is transferred between multiple devices, then cleaning steps can be completed, but wafer damage risk increases
Solution Approach 1:
By combining all cleaning functions in a single apparatus with a shared wafer support disk, the patent eliminates the mechanical transfer steps between devices. The wafer remains on the same support disk throughout the entire cleaning process, eliminating damage risks associated with picking, placing, and transferring wafers between separate devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous single wafer soaking, cleaning, and etching processes on the same device, reducing wafer damage from transfers and improving efficiency and yield by simplifying the process and reducing production costs.
Implementation Method 1
a wafer spin chuck connected to the spin driver device, driven by the spin driver device to spin
Implementation Method 2
a vacuum pump connection port is disposed on the spin driver device, a vacuum suction hole is formed through the wafer spin chuck and communicates with the vacuum pump connection port
Data Source
AI summary
A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.