Singular Die Solder Ball Bonding With ENEPIG Reconditioned Pads
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Solution Overview
Problem
Military-grade integrated circuits face reliability and durability issues due to their use of commercial-grade components in plastic packages, which are not designed for demanding temperature ranges, leading to obsolescence and inventory management challenges.
Innovation Solution
A singular die with reconditioned die pads featuring a metallic layer composition including electroless nickel, palladium, and immersion gold (ENEPIG) is used, eliminating the need for masks in solder ball deposition and enabling 3D printed hermetic encapsulation, allowing for cost-effective and reliable bonding in flip-chip applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If commercial-grade plastic packages are used for integrated circuits, then cost is reduced, but reliability and durability in demanding temperature environments deteriorate
Solution Approach 1:
The patent changes the material parameters of the packaging by replacing commercial plastic packages with hermetic ceramic or metal packages, fundamentally altering the thermal and environmental resistance properties to enable reliable operation in military-grade temperature ranges from -55°C to 125°C
Solution Approach 2:
The patent employs composite packaging structures combining hermetic barriers (ceramic or metal enclosures) with internal mounting substrates, creating a multi-material system that provides both environmental protection and electrical connectivity for extended temperature range operation
2Manufacturing precision
If masks are used for solder ball deposition on singular dice, then manufacturing precision is improved, but productivity and cost-effectiveness deteriorate
Solution Approach 1:
The patent removes the mask component entirely from the solder ball deposition process for singular dice, using direct deposition methods that eliminate mask alignment, application, and removal steps while maintaining precise solder ball placement through alternative positioning control mechanisms
Solution Approach 2:
The patent replaces the mechanical mask-based patterning system with a direct deposition system that uses controlled material placement mechanisms, eliminating the mechanical constraints of mask handling and enabling faster processing of individual dice
3Ease of manufacture
If COTS integrated circuits are purchased for military applications, then cost is reduced, but adaptability to demanding environmental conditions deteriorates
Solution Approach 1:
The patent creates a universal packaging solution using hermetic ceramic and metal packages that can accommodate various commercial off-the-shelf integrated circuits while providing military-grade environmental protection, enabling a single package type to serve multiple circuit configurations and temperature requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cost-effectiveness and reliability by providing a corrosion-resistant, conductive, and durable bonding interface, enabling the reuse of obsolete ICs in demanding environments without the need for masks and with improved precision and throughput.
Implementation Method 1
The reconditioned die pads include die pads of the singular die with a plurality of metallic layers applied
Implementation Method 2
A singular die with reconditioned die pads featuring a metallic layer composition including electroless nickel, palladium, and immersion gold (ENEPIG)
Implementation Method 3
One or more solder balls are between the one or more reconditioned die pads and the one or more bond pads
Data Source
AI summary
A device is provided. The device includes one or more of a singular die, one of another die, a printed circuit board, and a substrate, and one or more solder balls. The singular die includes one or more reconditioned die pads, which include die pads of the singular die with a plurality of metallic layers applied. The other die, printed circuit board, and the substrate include one or more bond pads. The one or more solder balls are between the one or more reconditioned die pads and the one or more bond pads.