Multi-axis Singulation Traverse for Plate Component Separation
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Solution Overview
Problem
Existing devices struggle to efficiently separate plate-shaped components of varying thickness and material properties from a stack, particularly thin flexible components which often get lifted along with others due to adhesive forces, and thick components which require different separation methods.
Innovation Solution
A multi-axis handling device with a separating device equipped with multiple separating means, controlled by a device that selectively activates different separating mechanisms based on the properties of the top component, such as a push-off unit for thick components and a gripper with air nozzle for thin components, allowing precise separation without lifting adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gripper is used to lift the top plate-shaped component, then separation is achieved, but thin or flexible components may be lifted along with components below due to adhesion forces
Solution Approach 1:
The singulation device is divided into multiple independent singulation means (first singulation means for thick components, second singulation means for thin components) that can be selectively activated. This segmentation allows each means to be optimized for specific component types, preventing adhesion-related failures when handling thin or flexible components.
Solution Approach 2:
The system changes operational parameters by selecting different singulation means based on component properties (thickness, flexibility, adhesion characteristics). For thin components with high adhesion, a different approach (second singulation means) is used compared to thick components, thereby adapting the separation method to the specific physical parameters of the material being handled.
2Reliability
If different devices are used for thin and thick plate-shaped components, then effective separation is achieved, but device complexity increases
Solution Approach 1:
Multiple singulation means that would traditionally require separate devices are merged into a single singulation device. The device includes a first singulation means (push-off unit with separating edge) and a second singulation means (gripper or suction gripper), both integrated into one structure that can be selectively activated based on component type.
Solution Approach 2:
The singulation device is designed as a universal device that can handle both thin and thick plate-shaped components, as well as components with different adhesion properties. The control device enables the same physical device to perform multiple functions by activating appropriate singulation means based on detected component properties.
3Manufacturing precision
If the stack height is adjusted for thick components using a separating edge, then separation works for thick components, but thin flexible components cannot be separated due to stack surface unevenness
Solution Approach 1:
The system transitions from a static separation approach (fixed separating edge height) to a dynamic approach where the control device selects between different singulation means based on real-time detection of component properties. This allows the system to adapt its separation method to match the specific characteristics of each component type.
Solution Approach 2:
The control device acts as an intermediary that detects component properties and selects the appropriate singulation means. This intermediary layer enables the system to bridge the gap between the physical separating edge and the varying requirements of different component types, particularly protecting thin components from the harsh mechanical action of the separating edge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the effective separation of both thin and thick plate-shaped components with different properties by using appropriate separating means, reducing the risk of lifting multiple components and overcoming resistance from cutting connections, thus improving the efficiency of component isolation.
Implementation Method 1
By at least partially lifting or bending the thin, plate-shaped component at the top, air can enter or be actively blown between it and the thin, plate-shaped component below. This allows the thin, plate-shaped component at the top to be lifted from the thin, plate-shaped component below
Data Source
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AI summary
A device for processing a stack (S) of plate-shaped components (51; 53) with a singulation device (100) by which a plate-shaped component can be removed from the stack, with a lifting device (5) for lifting the stack and with a control device for controlling the singulation device and the lifting device, is characterized in that the singulation device is designed as a singulation traverse which is movably mounted on a multi-axis handling device (4) in at least two directions (x, z) and has a plurality of singulation means.