Sinter-Bonding Sheet Composition for Low-Porosity Die Attach
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Solution Overview
Problem
In die bonding using a sinter-bonding composition with sinterable particles, achieving a high-density sintered layer for reliable bonding between a semiconductor chip and a support substrate is challenging due to high porosity, especially under low-loading conditions.
Innovation Solution
A sinter-bonding composition with sinterable particles having an average diameter of 2 μm or less and a high proportion (≥80% by mass) of particles ≤100 nm, along with a thermally decomposable polymeric binder, is used to form a high-density sintered layer under low-loading conditions, ensuring strong bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high loading conditions (high pressurization) are applied during sintering to reduce porosity, then bonding reliability is improved, but apparatus performance requirements and process complexity increase
Solution Approach 1:
The invention changes the particle size distribution parameter of the sinterable particles, specifically using particles with average diameter of 2 μm or less and a high proportion (≥80% by mass) of particles with diameter of 100 nm or less. This parameter change enables the formation of high-density sintered layers with low porosity under low-loading conditions, thereby improving bonding reliability without requiring high pressurization apparatus performance
Solution Approach 2:
The invention uses a composite sinter-bonding composition comprising sinterable particles (with specific size distribution), a thermally decomposable polymeric binder, and a solvent. This composite material formulation allows the sinterable particles to pack more efficiently and form dense sintered layers under reduced pressure conditions, resolving the contradiction between bonding reliability and apparatus performance requirements
2Reliability
If conventional sinter-bonding composition is used, then the sintering process can be carried out, but the sintered layer has high porosity and insufficient bonding reliability
Solution Approach 1:
The invention fundamentally changes the particle size distribution parameter by using sinterable particles with average diameter of 2 μm or less and ensuring that at least 80% by mass of particles have diameter of 100 nm or less. This parameter optimization enables the particles to pack more densely and form sintered layers with low porosity and high manufacturing precision, directly addressing the insufficient bonding reliability issue
Solution Approach 2:
The invention applies local quality by creating a specific particle size distribution within the composition where ultra-fine particles (≤100 nm) dominate. These fine particles fill voids between larger particles during sintering, locally improving the density and reducing porosity in the sintered layer, thereby achieving high bonding reliability without requiring excessive pressurization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively forms a high-density sintered layer with low porosity, enhancing bonding reliability and production efficiency by reducing the need for high pressurization during the sintering process.
Implementation Method 1
the resultant is subjected to a heating step under conditions of a predetermined temperature and pressure so that the volatilization of the solvent and the like in the sinter-bonding composition occur between the support substrate and the semiconductor chip thereon and sintering progresses among the sinterable particles
Implementation Method 2
a heating step under conditions of a predetermined temperature and pressure so that the volatilization of the solvent and the like in the sinter-bonding composition occur
Data Source
AI summary
The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).