Sinter Paste Solder Contact Surface for Aluminum Chip Conductor Paths
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Solution Overview
Problem
Current methods for producing solder contact surfaces on chips are complex, costly, and unsuitable for small quantities, as they require aluminum conductor paths that cannot be soft-soldered, limiting their applicability and efficiency.
Innovation Solution
A method involving the application of a sinter paste with soft-solderable and conductive particles onto a chip's conductor path, followed by solvent evaporation to form a solder contact surface, enabling soft soldering and allowing connections to other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wet-chemical, galvanic or physical sputtering methods are used to produce solder contact surfaces, then solderable contact surfaces can be formed, but the manufacturing process becomes complex, costly and unsuitable for small quantities
Solution Approach 1:
The patent uses a disposable sinter paste that is applied as a thin layer and then removed after serving its purpose of enabling soldering. This eliminates the need for complex, expensive, and permanent coating equipment while achieving reliable solderable surfaces. The paste is applied, heated to sinter the particles, and then easily removed, providing a simple and cost-effective solution for small batch production.
Solution Approach 2:
The patent replaces complex mechanical coating systems (wet-chemical, galvanic, or physical sputtering equipment) with a simple thermal processing approach. By applying a sinter paste and using controlled heating to evaporate the binder and sinter the conductive particles, the method achieves solderable surfaces without requiring sophisticated mechanical or chemical coating infrastructure.
2Ease of manufacture
If aluminum conductor paths are used on chips, then standard chip manufacturing is achieved, but soft soldering or low-temperature soldering becomes impossible without complex preparatory work
Solution Approach 1:
The patent applies a sinter paste containing conductive particles and binder to the aluminum conductor paths before soldering. This preliminary action creates a solder-receptive layer on the aluminum surface, enabling soft soldering without requiring complex preparatory treatments like oxidation or alloying that would otherwise be necessary for aluminum solderability.
Solution Approach 2:
The sinter paste acts as an intermediary material between the aluminum conductor path and the solder. The paste contains conductive particles that bond to the aluminum and provide a surface that is compatible with soft soldering, thus mediating the connection between materials that would otherwise be incompatible for low-temperature soldering.
3Reliability
If complex preparatory work is performed to enable soldering of aluminum, then soldering becomes possible, but the process becomes costly and time-consuming
Solution Approach 1:
The patent combines the conductor path and the solder contact surface preparation into a single integrated step. The sinter paste is applied directly to the conductor paths during manufacturing, and the subsequent heating process both cures the paste and creates the solderable surface, eliminating the need for separate preparatory treatment steps that would reduce productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a cost-effective, quick, and reliable way to create solderable chips, enabling efficient electrical connections with low electrical resistance and high mechanical resilience, suitable for small batch production.
Implementation Method 1
b. evaporating the solvent
Data Source
AI summary
A chip comprising a non-conductive substrate layer and at least one conductor path disposed on the substrate layer, the solder contact surface being at least partially formed on the conductor path, and a method for producing the solder contact surface on the chip including the steps of: applying a sinter paste to a contact location at least partially located on the conductor path, the sinter paste comprising particles of at least one soft-solderable and conductive material and at least one solvent; and evaporating the solvent.