Sinter Bonding Sheet Cavity Control for Thermal Cycle Reliability
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Solution Overview
Problem
The existing sinter bonding sheets fail to maintain sufficient bonding to adherends when subjected to repetitive temperature increases and decreases, leading to partial separation and cracking, which degrades the reliability of the bonding.
Innovation Solution
A sinter bonding sheet with a sinter bonding layer containing conductive metal particles and an organic binder, where the maximum cavity size on the surface is 100 μm or less and the cavity area proportion is 5% or less, ensuring stable bonding even under temperature fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sinter bonding layer is subjected to repetitive temperature increases and decreases, then the bonding strength deteriorates due to partial separation and cracking, but maintaining bonding strength under temperature fluctuations requires controlling cavity size
Solution Approach 1:
The invention changes the physical parameters of the sinter bonding layer by strictly controlling cavity size (maximum 100 μm) and cavity area proportion (5% or less). This parameter control prevents excessive thermal stress accumulation during temperature cycles, thereby maintaining bonding strength and structural integrity under repetitive temperature increases and decreases.
2Ease of manufacture
If larger cavities are present in the sinter bonding layer, then manufacturing is easier, but bonding reliability deteriorates under temperature fluctuations due to partial separation and cracking
Solution Approach 1:
The invention applies local quality control by specifying that only a small proportion (5% or less) of the sinter bonding layer area can contain cavities, and those cavities must be small (maximum 100 μm). This localized quality control allows some manufacturing flexibility while ensuring that critical areas maintain high bonding reliability under temperature fluctuations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sinter bonding sheet effectively maintains bonding between the sinter bonding layer and adherends during repetitive temperature changes, preventing partial separation and cracking, thus enhancing the reliability of the bonding.
Implementation Method 1
The intermediate product of the semiconductor device is subjected to sintering treatment in which the intermediate product of the semiconductor device is heated at a temperature at which sinterable particles in the sinter bonding layer can be sintered to each other, to thereby at least partially eliminate the organic binder from the sinter bonding layer while sintering the sinterable particles to each other.
Data Source
AI summary
Provided is a sinter bonding sheet including a sinter bonding layer that includes: sinterable particles containing a conductive metal; and an organic binder, in which a maximum size among sizes of cavities observed in an observation image of a surface of the sinter bonding layer at a magnification of 100 times is 100 μm or less.