Sinter Bonding Sheet Roll Layout for Larger Transfer Area
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Solution Overview
Problem
In the production of semiconductor apparatus using a band-shaped sinter bonding sheet roll, the effective transferring area for semiconductor devices is often insufficient, leading to a reduction in production yield due to inadequate utilization of the sinter bonding layer.
Innovation Solution
A sinter bonding sheet roll is designed with a first substrate and a sinter bonding layer containing conductive metal particles and an organic binder, where the longitudinal dimension of the first substrate is larger than that of the sinter bonding layer and any secondary substrate, allowing for enhanced utilization of the sinter bonding layer during the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the sinter bonding sheet is formed with the sinter bonding layer having the same longitudinal dimension as the substrate, then the structure is simple and easy to manufacture, but the effective transferring area is insufficient leading to reduced production yield
Solution Approach 1:
The patent extends the longitudinal dimension of the substrate beyond the sinter bonding layer, creating an overhanging structure. This dimensional extension in the longitudinal direction provides additional effective transferring area, allowing multiple semiconductor devices to be transferred along the length direction, thereby improving production yield without adding complex multi-layer structures.
Solution Approach 2:
The extended substrate structure allows the sinter bonding sheet to serve multiple transfer positions along the longitudinal direction. The substrate is effectively segmented into multiple transfer zones, each capable of transferring semiconductor devices, thereby increasing the overall productivity and utilization ratio of the sinter bonding layer.
2Productivity
If the longitudinal dimension of the sinter bonding layer is increased to provide sufficient effective transferring area, then the production yield improves, but the amount of sinterable particles and organic binder increases leading to higher material consumption
Solution Approach 1:
Instead of increasing the longitudinal dimension of the sinter bonding layer itself, the patent extends the substrate dimension. This allows the same amount of sinter bonding material to serve multiple transfer positions along the extended substrate length, thereby improving utilization ratio without increasing material consumption.
Solution Approach 2:
The extended substrate structure enables the sinter bonding layer to serve multiple functions at different longitudinal positions. A single sinter bonding layer configuration is used repeatedly across multiple transfer positions, maximizing its utilization and reducing the total material needed compared to having separate sinter bonding layers for each position.
3Productivity
If the sinter bonding sheet roll is used in roll-to-roll production, then the manufacturing efficiency increases, but the effective transferring area becomes insufficient due to the winding configuration
Solution Approach 1:
The extended longitudinal dimension of the substrate in the roll-to-roll configuration allows multiple transfer positions to be accommodated along the length direction of the wound roll. This dimensional extension ensures that sufficient effective transferring area is available even when the sheet is wound into a compact roll format, maintaining both manufacturing efficiency and adequate transfer area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a sufficient effective area for transferring semiconductor devices, thereby suppressing the reduction in production yield and improving the utilization ratio of the sinter bonding layer.
Implementation Method 1
heated at a temperature at which the sinterable particles can be sintered to each other, to cause at least a part of the organic binder to be burned out from the sinter bonding layer, while allowing the sinterable particles to be sintered to each other in the sinter bonding layer
Implementation Method 2
heated at a temperature at which the sinterable particles can be sintered to each other, to cause at least a part of the organic binder to be burned out from the sinter bonding layer
Data Source
AI summary
A sinter bonding sheet roll according to the present invention includes a first substrate and a sinter bonding layer laminated on the first substrate, and is formed by winding, in a length direction, a sinter bonding sheet that is formed into a band shape, in which the sinter bonding layer includes sinterable particles containing a conductive metal, and an organic binder, and is directly laminated on the first substrate or is indirectly laminated on the first substrate via a second substrate interposed therebetween, and a longitudinal dimension L1 of the first substrate is larger than any of a longitudinal dimension LS of the sinter bonding layer and a longitudinal dimension L2 of the second substrate.