Sinterable Bonding Material for Semiconductor Devices
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Solution Overview
Problem
Existing bonding materials for semiconductor devices face challenges in maintaining bonding strength and thermal conductivity while reducing stress applied to bonded parts, especially under high-temperature conditions, leading to potential cracks or exfoliation due to thermal expansion differences and insufficient stress relaxation.
Innovation Solution
A sinterable bonding material comprising silver fillers with a flake-shaped structure and resin particles having specific elastic modulus and heat decomposition temperature, which reduces stress on bonded parts while maintaining excellent bonding strength and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a paste containing nano-sized metal fine particles is used as a bonding material to achieve excellent thermal conductivity, then thermal conductivity is improved, but shrinkage stress is generated by sintering shrinkage and remains in the bonded part
Solution Approach 1:
The patent changes the particle size parameter from nano-sized to micro-sized metal particles, which fundamentally alters the sintering behavior and stress characteristics. This parameter change allows the bonding material to maintain thermal conductivity while significantly reducing shrinkage stress in the bonded part.
Solution Approach 2:
The patent creates a composite bonding material system consisting of metal particles (for thermal conductivity and bonding) combined with organic particles (for stress reduction). This composite approach allows the material to simultaneously achieve excellent thermal conductivity while minimizing shrinkage stress through the complementary properties of the different particle types.
2Adaptability or versatility
If members to be bonded have largely different thermal expansion coefficients, then bonding versatility is improved, but higher thermal stress is applied to the bonded part during cooling-heating cycles, leading to cracks or exfoliation
Solution Approach 1:
The patent modifies the particle size parameter of the bonding material from nano to micro scale, which changes the mechanical properties and stress distribution characteristics. This parameter change enables the bonding material to accommodate thermal expansion differences between dissimilar materials while maintaining bond integrity during thermal cycling.
Solution Approach 2:
The bonding material acts as an intermediary layer between members with different thermal expansion coefficients. The organic particles in the bonding material provide stress relaxation capabilities that mediate the thermal stress generated by mismatched expansion coefficients, preventing crack formation and exfoliation during cooling-heating cycles.
3Ease of manufacture
If conventional resin particles are used in the bonding material, then ease of manufacture is improved, but the heat resistance of the resin is insufficient, causing deterioration of mechanical characteristics during sintering or high temperature operation
Solution Approach 1:
The patent changes the heat resistance parameter of the resin particles by selecting materials with appropriate glass transition temperatures and thermal stability. This parameter change enables the resin particles to maintain their mechanical characteristics during sintering and high-temperature operation while still providing stress relaxation functionality.
Solution Approach 2:
The patent creates a composite particle system where organic particles with specific thermal properties are combined with metal particles. This composite approach allows the organic component to provide stress relaxation while the metal component ensures thermal conductivity and bonding strength, with both components maintaining stability at sintering and operating temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bonding material achieves superior bonding strength, thermal conductivity, and long-term reliability by effectively managing stress and heat release in semiconductor devices, even under high-temperature conditions, thereby preventing cracks and exfoliation.
Implementation Method 1
a sintering phenomenon of metal particles is utilized for the bonding
Implementation Method 2
a bonding material having an excellent thermal conductivity is required, which can efficiently release the heat generated in operation of the semiconductor
Implementation Method 3
the stress applied to a bonded part can be reduced
Data Source
AI summary
An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.