Sinterable Die Attach Films for Low-Pressure Lamination
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Solution Overview
Problem
Conventional sintering films in the die attach industry face challenges with high metal content leading to surface dryness, hindering lamination and bonding, and require high temperatures and pressures that exceed the capabilities of standard semiconductor equipment, making them unsuitable for lead-free materials and high circuit density semiconductor devices.
Innovation Solution
Development of sinterable films and pastes with compositions including thermosetting or thermoplastic resin components, such as epoxy resins, acrylic polymers, and conductive fillers like silver, which enable low-temperature and low-pressure lamination, maintaining wetting ability and achieving proper sintering morphology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sintering films with high metal content are used, then electrical and thermal conductivity is improved, but surface dryness occurs which hinders lamination and bonding performance
Solution Approach 1:
A binder system comprising thermoplastic resin and thermosetting resin is introduced as an intermediary between the metal particles and the lamination process. The thermoplastic resin provides initial adhesion and the thermosetting resin cures to form a strong bond, enabling effective lamination and bonding while maintaining the high metal content (60-95 wt%) needed for electrical and thermal conductivity
Solution Approach 2:
The sintering film is formulated as a composite material system containing metal particles (60-95 wt%), thermoplastic resin (1-30 wt%), and thermosetting resin (1-30 wt%). This composite structure allows the metal particles to provide conductivity while the resin matrix provides binding and lamination capabilities, resolving the contradiction between high metal content and lamination performance
2Strength
If high temperatures and pressures are applied for lamination and bonding, then bonding strength is improved, but the process exceeds the capacities of commonly used semiconductor equipment
Solution Approach 1:
The binder system is designed to enable lamination and bonding at reduced temperatures (e.g., 100-200°C for lamination, 200-400°C for bonding) and pressures compared to conventional sintering films. The thermoplastic resin softens at lower temperatures to facilitate lamination, and the thermosetting resin cures to provide strong bonding, eliminating the need for high-temperature high-pressure equipment
3Reliability
If conventional sintering films are used, then lead-free compliance is achieved, but the high metal content causes surface dryness that prevents proper lamination
Solution Approach 1:
The binder system acts as an intermediary that bridges the high metal content formulation and the lamination process. The thermoplastic and thermosetting resins provide the necessary surface properties and adhesion mechanisms to enable proper lamination of lead-free compliant sintering films with 60-95 wt% metal content
Solution Approach 2:
The film is formulated as a composite with metal particles (60-95 wt%), thermoplastic resin (1-30 wt%), and thermosetting resin (1-30 wt%). This composite structure maintains lead-free compliance while the resin components prevent surface dryness and enable lamination processability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sinterable films and pastes allow for efficient lamination and bonding at reduced temperatures and pressures, ensuring high electrical and thermal conductivity while adhering to lead-free regulations, suitable for advanced semiconductor applications.
Implementation Method 1
a) A conductive pattern is formed on a green body of a ceramic component by printing a sinterable paste thereon; b) The green body with the conductive pattern is sintered to sinter the conductive paste
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.