Sinterable Nanoparticle Optical Adhesives for Vacuum Compatibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Organic-based adhesives used in optical data links degrade in harsh environments, such as space, leading to outgassing and mechanical failure, which reduces optical coupling efficiency and lifespan.
Innovation Solution
Employing sintered nanoparticle connectors made from metallic nanoparticles, which are organic-free and resistant to extreme temperatures, to secure optical fibers and waveguides in photonics systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic-based adhesives (epoxy or glue) are used to secure the lid to the PIC, then the fiber can be retained within the V-groove and optical coupling can be achieved, but in low pressure environments (vacuum of space) outgassing occurs leading to contamination of the optical path and reduction in optical coupling efficiency
Solution Approach 1:
The patent removes the organic adhesive material entirely from the system and replaces it with a metallic nanoparticle sintered connector. This extraction of the harmful organic component eliminates the outgassing source while maintaining the mechanical function of securing the lid to the PIC.
Solution Approach 2:
The patent changes the material parameter from organic-based adhesive to metallic nanoparticle composition. This fundamental material parameter change transforms the substance from one that outgasses in vacuum to one that is vacuum-compatible, directly addressing the contamination issue while maintaining structural integrity.
2Strength
If organic-based adhesives are used in harsh environments (like space), then the fiber can be secured, but extreme temperatures cause mechanical degradation by making the epoxy more brittle or reducing adhesive strength
Solution Approach 1:
The patent removes the temperature-sensitive organic adhesive and replaces it with a metallic nanoparticle sintered connector that inherently possesses high-temperature stability. This extraction eliminates the source of temperature-induced mechanical degradation.
Solution Approach 2:
The patent employs a composite structure of metallic nanoparticles sintered together to form a connector that combines the advantages of metal (high-temperature resistance) with the functionality of an adhesive (securing components). This composite approach achieves both strength and temperature resistance.
3Ease of manufacture
If traditional adhesive materials are used, then the manufacturing process is simple, but the materials are organic in nature and problematic in low pressure environments
Solution Approach 1:
The patent extracts the organic adhesive material and replaces it with a metallic nanoparticle sintered connector. Although the manufacturing process becomes slightly more complex (requiring nanoparticle deposition and sintering), the elimination of outgassing contamination provides a net benefit for space applications.
Solution Approach 2:
The patent changes the material composition parameter from organic to metallic nanoparticle-based. This parameter change fundamentally alters the material's behavior in vacuum environments, eliminating outgassing while maintaining manufacturability through established nanoparticle processing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sintered nanoparticle connectors provide a robust and contamination-free mechanical coupling solution, maintaining optical efficiency and extending the lifespan of photonics systems in harsh environments.
Implementation Method 1
The nanoparticle paste is then heated, causing the nanoparticles to sinter together, to form a mechanical connector between the first substrate and the second substrate.
Data Source
AI summary
Embodiments disclosed herein include an apparatus with a first substrate, and a groove in a surface of the first substrate. In an embodiment, a fiber is in the groove, and a second substrate is over the first substrate and the fiber. In an embodiment, a porous metallic material is provided between the first substrate and the second substrate.