Sinterable Paste Carrier for Semiconductor Connection
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Solution Overview
Problem
The existing methods for producing semiconductor carriers and clips are costly due to the separate application and sintering of solder, increasing process and material expenses.
Innovation Solution
A carrier or clip with a functional surface coated with a sinterable solidified paste containing silver and/or silver compounds, along with 0.1%-2% fatty acids or organic binders, which forms an intermediate product that can be connected to a semiconductor element through sintering, reducing production costs and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is applied in a separate process, then the connection between carrier and semiconductor element is achieved, but the process and material costs increase
Solution Approach 1:
The patent combines the solder layer and carrier into a single integrated component. The solder paste is applied to the carrier in a first process step, then both are sintered together in a second process step to form an indivisible unit. This eliminates the need for separate solder application to the semiconductor element, reducing both material costs (no separate solder material needed) and process costs (fewer manufacturing steps), while maintaining reliable electrical and mechanical connections.
2Reliability
If solder is applied in a separate process, then the connection is achieved, but the number of process steps increases
Solution Approach 1:
The patent merges the carrier production and solder application into one integrated manufacturing process. The solder paste is applied to the carrier substrate, then both are sintered together in sequence to create a unified component. This reduces the total number of process steps from multiple separate operations (carrier fabrication, separate solder application, assembly) to two main steps, thereby improving productivity and manufacturing efficiency.
Solution Approach 2:
The solder paste is applied to the carrier in advance during carrier production, before the actual assembly with the semiconductor element. This preliminary action allows the carrier to be pre-prepared with its connection layer, so that during final assembly only the sintering step is needed to activate the connection. This reduces on-site process steps and improves overall manufacturing efficiency.
3Ease of manufacture
If the carrier is produced separately from the sinterable layer, then the carrier can be manufactured, but additional processing steps are required
Solution Approach 1:
The patent integrates the sinterable layer (solder paste) directly onto the carrier during carrier production. The solder paste is applied to the carrier substrate and then both are sintered together in a unified process, creating an indivisible integrated component. This eliminates the need for separate production and assembly steps, reducing production process complexity while maintaining ease of manufacture through standardized integrated fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the simultaneous production and handling of the carrier or clip with a sinterable layer, reducing material and process costs while enabling efficient connection to semiconductor elements, thereby simplifying the production of semiconductor components.
Implementation Method 1
The actual connection is then carried out by sintering the carrier to the semiconductor element using the paste
Data Source
AI summary
A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.