Sintered Aluminum Electrodes with Deformable Interconnects
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Solution Overview
Problem
Existing energy storage capacitors for implantable medical devices face challenges in efficiently and economically increasing energy storage while reducing size, often resulting in fragile etched electrodes that break under bending pressure, leading to manufacturing issues and component failures.
Innovation Solution
The use of flexible foil substrates and sintered electrodes with deformable interconnects, such as slotted comb-type interconnects or wires between sintered substrates, to couple multiple substrates together, providing a robust and flexible energy storage solution that accommodates displacement and reduces stress on components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If etched electrodes are used to increase energy storage, then DC capacitance is improved, but the electrodes become fragile and break under bending pressure
Solution Approach 1:
The patent changes the manufacturing parameter from etching to sintering, which fundamentally alters the electrode structure from thin and fragile to thick and robust. This parameter change enables the electrode to maintain high DC capacitance while gaining mechanical strength and flexibility resistance.
Solution Approach 2:
The patent uses composite materials by combining sintered aluminum oxide with conductive materials to create an electrode structure that possesses both high electrical conductivity and enhanced mechanical properties. This composite approach resolves the contradiction between achieving high capacitance and maintaining electrode durability.
2Reliability
If sintered electrodes are used instead of etched electrodes, then electrode robustness is improved, but manufacturing complexity increases
Solution Approach 1:
The sintering process inherently creates the desired porous structure and mechanical properties without requiring additional complex manufacturing steps. The self-service nature of sintering simplifies the overall manufacturing process despite the initial perception of increased complexity.
Solution Approach 2:
By changing the fundamental manufacturing parameter from etching to sintering, the patent simplifies certain aspects of manufacturing while achieving superior electrode robustness. The sintering process consolidates multiple functions into a single step, reducing overall manufacturing complexity.
3Adaptability or versatility
If flexible foil substrates are used, then device flexibility is improved, but structural strength decreases
Solution Approach 1:
The patent creates a composite structure where the flexible foil substrate is combined with sintered electrode material. This composite approach allows the substrate to maintain flexibility while the sintered layer provides the necessary structural strength and electrical properties.
Solution Approach 2:
The patent employs flexible foil substrates as the base structure, which provides the necessary flexibility for implantable devices. The substrate is designed to be thin and flexible while supporting the sintered electrode material that provides structural reinforcement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a 30% improvement in DC capacitance over etched capacitors, enabling smaller, more efficient, and cost-effective high-energy, high-voltage capacitors suitable for medical devices and other applications, with reduced risk of component failure and improved manufacturing yields.
Implementation Method 1
an electrode including a sintered material deposited on a conductive substrate
Data Source
AI summary
This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb-shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.