Semiconductor Chip Sintered Bond Structure for Stronger Peripheral Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices using metal sintered materials, the lack of pressure on surrounding paste areas leads to insufficient sintering, resulting in weakly bonded metal strips that can disengage and reduce the reliability of the device.
Innovation Solution
A semiconductor device design where a metal sintered material with a first portion overlapping the semiconductor chip and a second portion surrounding it is used, with the porosity ratio of the first portion being between 1% and 15% and the second portion between 15% and 50%, and applying pressure to the peripheral area of the paste to ensure uniform sintering and improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pressure is applied only to the paste in chip mounting areas, then the sintering in those areas is sufficient, but the paste in surrounding areas is not sufficiently sintered resulting in weak bonding
Solution Approach 1:
The invention applies different pressure conditions to different regions of the paste: the paste in chip mounting areas receives pressure through the semiconductor chip during bonding, while the paste in surrounding areas is subjected to preliminary pressure before chip mounting. This local differentiation ensures sufficient sintering in both regions without compromising bonding strength.
2Area of stationary object
If the paste is printed around the chip mounting areas, then the coverage is improved, but the unsintered metal strips may disengage causing malfunction
Solution Approach 1:
The invention applies pressure to the paste in surrounding areas before the semiconductor chip is mounted. This preliminary pressure treatment ensures that the paste in these areas is sufficiently sintered and forms strong bonds before the chip bonding process, preventing disengagement and malfunction in subsequent steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding strength of the metal sintered material, reducing the risk of disengagement and improving the overall reliability of the semiconductor device.
Implementation Method 1
heating and applying pressure to the paste of a metal sintered material through the semiconductor chip
Data Source
AI summary
A semiconductor device includes a metal chip mounting member and a semiconductor chip bonded to the chip mounting member through a metal sintered material, wherein the metal sintered material includes a first portion overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the semiconductor chip in the plan view, and wherein a porosity ratio of the first portion is greater than or equal to 1% and less than 15%, and a porosity ratio of the second portion is greater than or equal to 15% and less than or equal to 50%.