Sintered material, connection structure, composite particle, joining composition, and method for manufacturing sintered material
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Solution Overview
Problem
Conventional sintered materials used as connection members in semiconductor devices face challenges in achieving both thermal stress relief and bonding strength, with porous structures compromising strength and dense layers reducing thermal stress relief effectiveness.
Innovation Solution
A sintered material comprising a metal base portion, buffer portions (pores or different materials), and filling portions (particles or fibers) is developed, where the kurtosis of the volume distribution is controlled to ensure both thermal stress relief and bonding strength, with the filling portions dispersing the buffer portions uniformly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pores are introduced in sintered material to relieve thermal stress, then thermal stress relief effect is improved, but bonding strength is reduced
Solution Approach 1:
The invention applies local quality by creating distinct regions within the sintered material: a first region with higher porosity (20-40%) for thermal stress relief and a second region with lower porosity (10-20%) for bonding strength. This spatial differentiation of material properties allows each region to optimize its function locally, resolving the contradiction between thermal stress relief and bonding strength.
Solution Approach 2:
The sintered material is segmented into multiple regions with different porosity characteristics. The first region (buffer portion) contains more pores for thermal stress absorption, while the second region (filling portion) has fewer pores for structural integrity. This segmentation allows the material to simultaneously achieve both thermal stress relief and bonding strength requirements.
2Strength
If a dense layer with low porosity is added to increase bonding strength, then bonding strength is improved, but thermal stress relief effect is reduced
Solution Approach 1:
Rather than adding a separate dense layer as a distinct component, the invention segments the sintered material itself into regions with different porosity levels. The second region provides the necessary bonding strength while the first region maintains thermal stress relief, eliminating the need for additional layers and avoiding reduction in thermal stress relief effect.
Solution Approach 2:
The invention merges the functions of thermal stress relief and bonding strength enhancement into a single integrated sintered material structure. By controlling porosity distribution within the same material body, both functions are achieved simultaneously without requiring separate components, thus maintaining thermal stress relief effectiveness while providing adequate bonding strength.
3Reliability
If porosity is increased to enhance thermal stress relief, then thermal stress relief effect is improved, but manufacturing complexity increases
Solution Approach 1:
The invention controls porosity by adjusting sintering parameters (temperature, pressure, time) and particle size distribution of raw materials. By optimizing these manufacturing parameters, the desired porosity distribution (first region: 20-40%, second region: 10-20%) is achieved directly during the sintering process, avoiding complex post-processing steps and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sintered material exhibits excellent thermal stress relief and bonding strength, making it suitable for semiconductor devices, with the composite particles used as raw materials to form the filling portions, enhancing the uniform distribution and affinity with the base material.
Implementation Method 1
the pores have an effect of relieving thermal stress
Implementation Method 2
a base portion, one or more buffer portions, and one or more filling portions, the base portion being a metal sintered body
Data Source
AI summary
A sintered material excellent in thermal stress and bonding strength; a connection structure containing the sintered material; a composition for bonding with which the sintered material can be produced; and a method for producing the sintered material. The sintered material has a base portion, buffer portions, and filling portions. The buffer portions and filling portions are dispersed in the base portion. The base portion is a metal sintered body, each buffer portion is formed from a pore and/or material that is not the same as the sintered body, and each filling portion is formed from particles and/or fibers. The sintered material satisfies A>B. A is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material. B is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material from which the filling portions are removed.