Sintered Complex Oxide Sputtering Target Suppressing Anomalous Discharge
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Solution Overview
Problem
Conventional zinc oxide-based sputtering targets face challenges in inhibiting anomalous discharge during sputtering, leading to reduced yields and lower productivity in thin-film production.
Innovation Solution
A sintered complex oxide with a specific structure, comprising metal oxide particles with a hexagonal lamellar structure containing zinc oxide and indium, and metal oxide particles with a spinel structure containing aluminum or gallium, is used as a sputtering target, where the mean long diameter of these particles is limited to no greater than 10 μm, and at least 20% have an aspect ratio of 2 or greater, along with a method for producing this complex oxide through mixing and firing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional zinc oxide-based sputtering targets are used, then the main component zinc oxide provides good transparency and conductivity, but anomalous discharge occurs during sputtering resulting in reduced availability factor and lower product yield
Solution Approach 1:
The patent uses a composite sintered compact containing zinc oxide particles (main component), aluminum oxide particles (Group III element oxide), and a binder. This composite structure suppresses anomalous discharge during sputtering while maintaining the transparency and conductivity properties of zinc oxide, thereby resolving the contradiction between reliability and productivity
Solution Approach 2:
The patent specifies precise particle size parameters: zinc oxide particles of 0.5-5 μm, aluminum oxide particles of 0.1-1 μm, and limits the aluminum oxide content to 1-10 wt%. These parameter optimizations suppress anomalous discharge and improve sputtering stability,从而 resolving the contradiction between reliability and productivity
2Ease of manufacture
If zinc oxide-based sputtering targets are used, then cost reduction is achieved compared to ITO films, but anomalous discharge reduces availability factor of sputtering apparatus
Solution Approach 1:
The composite structure with zinc oxide as main component (90-98 wt%), aluminum oxide as additive (1-10 wt%), and binder (2-5 wt%) maintains cost advantage while suppressing anomalous discharge through the aluminum oxide particles, thereby resolving the contradiction between ease of manufacture and reliability
Solution Approach 2:
The patent optimizes particle size distribution (zinc oxide: 0.5-5 μm, aluminum oxide: 0.1-1 μm) and compositional ratios to suppress anomalous discharge while maintaining cost-effectiveness, resolving the contradiction between ease of manufacture and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly inhibits anomalous discharge during sputtering, resulting in higher productivity and improved humidity resistance of the thin-films produced.
Implementation Method 1
When known zinc oxide-based sputtering targets of the prior art are used as means for forming thin-films such as transparent conductive films
Implementation Method 2
an inhibiting effect by high-densification of the sintered compacts through modification of the production method
Data Source
AI summary
A sintered complex oxide comprising metal oxide particles (a) having a hexagonal lamellar structure and containing zinc oxide and indium, and metal oxide particles (b) having a spinel structure and containing a metal element M (where M is aluminum and/or gallium), wherein the mean value of the long diameter of the metal oxide particles (a) is no greater than 10 μm, and at least 20% of the metal oxide particles (a) have an aspect ratio (long diameter/short diameter) of 2 or greater, based on the number of particles.