Sintered Conductive Polymer Shield for Lightweight EM Interference
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Solution Overview
Problem
Existing electromagnetic (EM) shielding solutions for electronic components are bulky, costly, and difficult to integrate into complex, portable, and lightweight devices, as they require custom-designed metal housings that add weight and volume, and often provide inadequate protection against EM interference.
Innovation Solution
A polymeric structure with a shielding layer formed by sintering conductive pathways from sinterable particles, which is electrically coupled to a conductive contact and can be deposited over electronic components on a circuit board, providing customizable EM shielding without the need for bulky metal housings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal housing is used for EM shielding, then EM shielding effectiveness is improved, but weight and volume increase
Solution Approach 1:
The patent changes the material parameter from traditional metal to polymer composite material. The polymer shielding material contains conductive fillers (such as metal particles, carbon fibers, or conductive polymers) dispersed in a polymer matrix, transforming the physical and chemical properties of the shielding material to achieve both light weight and effective EM shielding.
Solution Approach 2:
The patent employs composite material structure by combining polymer base material with conductive fillers. This creates a composite shielding material that integrates the light weight and flexibility advantages of polymers with the EM shielding capabilities of conductive materials, resolving the contradiction between shielding effectiveness and weight.
2Object-affected harmful factors
If metal housing is used for EM shielding, then EM shielding effectiveness is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent changes the manufacturing approach from traditional metal housing fabrication (requiring cutting, welding, and assembly) to polymer processing techniques such as injection molding or extrusion. This parameter change in manufacturing method simplifies the production process, reduces device complexity, and enables automated manufacturing while maintaining shielding effectiveness.
Solution Approach 2:
The patent merges the shielding function with the structural housing components. Instead of adding a separate metal shielding layer, the conductive polymer material is integrated directly into the housing structure, combining mechanical support and EM shielding functions into a single component, thereby reducing overall device complexity.
3Object-affected harmful factors
If custom-designed metal housing is used for each circuit board, then EM shielding effectiveness is improved, but cost increases
Solution Approach 1:
The patent creates a universal polymer shielding material that can be applied to multiple different circuit board designs and electronic components. The conductive polymer compound serves as a multi-functional material that provides EM shielding across various frequencies and applications, eliminating the need for custom-designed metal housings for each specific circuit board and thereby reducing manufacturing costs.
Solution Approach 2:
The patent changes the material form from rigid custom-fitted metal housings to flexible polymer shielding material that can be molded into various shapes and configurations. This parameter change enables a single base material to be adapted for different applications through molding processes, reducing the need for multiple custom designs and lowering overall manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymeric structure effectively shields electronic components from EM radiation, is lightweight, and can be easily manufactured using automated processes, offering a cost-effective and flexible solution for EM shielding in various devices.
Implementation Method 1
a shielding polymer layer deposited over the electronic component and including a network of conductive pathways formed from sintered particles
Implementation Method 2
The EM shield creates a Faraday cage around the sensitive electronic component(s). This EM shield can protect sensitive circuitry from a myriad of signals generated close to and remote from the sensitive circuitry.
Implementation Method 3
an electrically insulating polymer layer (hereinafter "insulating polymer layer") is deposited between the shielding polymer layer and the electronic component, such that the insulating polymer layer electrically insulates the electronic component from the shielding polymer layer
Data Source
AI summary
An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.