Sintered Metal Joining for Semiconductor Units
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Solution Overview
Problem
The existing methods for assembling semiconductor devices using solder result in solder erosion, which deteriorates the quality of the semiconductor units and devices due to remelted solder reacting with electrodes, leading to compromised joining characteristics.
Innovation Solution
The use of sintered metal joining materials with high melting points, such as silver or copper, that irreversibly transition into a solid-phase state, preventing electrode erosion and improving the reliability of semiconductor units by maintaining the integrity of the joining process at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder is used to join semiconductor units to the base plate, then the semiconductor units can be fixed onto the base plate, but the solder remelts during heating and causes electrode erosion
Solution Approach 1:
The patent changes the material parameter of the joining substance from solder (low melting point) to a joining substance with a melting point higher than the semiconductor element's melting point. This parameter change ensures that during the heating process, the joining substance remains solid while solder remelts, preventing electrode erosion and improving joining reliability
Solution Approach 2:
The patent employs a composite material system where a joining substance (with high melting point) is used in combination with solder (with lower melting point). The joining substance acts as a protective layer that prevents solder from directly contacting and eroding the electrode, creating a multi-layer protective structure that resolves the contradiction between ease of manufacture and joining reliability
2Productivity
If solder is used to join semiconductor units, then the units can be assembled, but electrode erosion occurs leading to deterioration of semiconductor unit characteristics
Solution Approach 1:
The patent changes the melting point parameter of the joining substance to be higher than that of the semiconductor element. This ensures that during assembly heating, the joining substance does not remelt while solder does, preventing electrode erosion and maintaining manufacturing precision while preserving assembly productivity
Solution Approach 2:
The joining substance acts as an intermediary layer between the electrode and the remelted solder. It mediates the interaction by preventing direct contact between the solder and electrode during heating, thus protecting the electrode from erosion while allowing the assembly process to proceed efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality and reliability of semiconductor devices by preventing electrode erosion and reducing thermal stress, thereby improving the yield rate and maintaining the structural integrity of the semiconductor units.
Implementation Method 1
a joining material which irreversibly makes phase transition into a solid-phase state
Implementation Method 2
The joining material may be sintered metal particles
Data Source
AI summary
A semiconductor device includes a plurality of semiconductor units each including a laminated substrate formed by laminating an insulating board and a circuit board and a semiconductor element joined to the circuit board using a joining material which irreversibly makes a phase transition into a solid-phase state. In addition, the semiconductor device may include a base plate to which each of the plurality of semiconductor units is joined using solder and a connection unit which electrically connects the plurality of semiconductor units in parallel.