Sintered Power Module Layout for Uniform Multi-Plane Pressure
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Solution Overview
Problem
Existing power electronic modules face challenges in achieving uniform pressure distribution and high-quality sintered connections across multiple planes due to varying surface areas and mechanical pressure requirements, which complicates the sintering process.
Innovation Solution
A power electronic module design and method that ensures a consistent surface area ratio of sintered connections between planes, allowing simultaneous sintering in multiple planes with controlled pressure application, using compensating elements to equalize surface areas and distribute force uniformly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pressure sintering is applied to multiple planes with different surface areas, then sintered connections are formed in multiple planes, but uniform pressure distribution becomes difficult to achieve
Solution Approach 1:
The patent applies different surface area compensating elements to different planes based on their specific surface area requirements. Each plane receives localized compensation tailored to its geometry, ensuring that the pressure distribution is optimized locally for each joining zone rather than applying a uniform approach across all planes.
Solution Approach 2:
Surface area compensating elements are introduced as intermediary components between the pressing device and the substrates. These compensating elements mediate the pressure transmission, distributing the mechanical pressure uniformly across planes with different surface areas by compensating for area differences.
2Reliability
If mechanical pressure of 10-20 MPa is applied for sintering, then effective sintered connections are formed, but the process becomes complex for multiple planes
Solution Approach 1:
The surface area compensating elements are prepared and positioned in advance before the sintering process begins. By pre-configuring the compensating elements to match the specific surface area requirements of each plane, the actual sintering process becomes simpler as it only requires applying the standard pressure range without complex real-time adjustments.
3Productivity
If multiple planes are sintered simultaneously, then processing time is reduced, but pressure distribution control becomes more difficult
Solution Approach 1:
The patent modifies the surface area parameter of the compensating elements to compensate for differences in plane surface areas. By changing the surface area parameter of the compensating elements rather than the pressure parameter during simultaneous sintering, the system maintains pressure control accuracy while achieving high productivity through parallel processing of multiple planes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates high-quality sintered connections in multiple planes with reduced processing time and simplified manufacturing by ensuring uniform pressure distribution, thereby improving the efficiency and quality of the sintering process.
Implementation Method 1
Pressure sintered connections made of Ag or soft solder connections are primarily used to realize these joining planes
Data Source
AI summary
Various embodiments of the teachings herein include a sintered power electronic module with a first plane and a second plane different from the first plane. An example comprises: a first substrate with a first metallization arranged on the first plane; a second substrate with a second metallization arranged on the second plane; a switchable die having a first power terminal and a second power terminal, the die arranged between the first substrate and the second substrate; and a surface area of all the sintered connections of the first plane is between 90 and 110% of a surface area of all the sintered connections of the second plane. The first power terminal of the die is joined to the first metallization via a sintered connection in the first plane and the second power terminal is joined to the second metallization via a sintered connection in the second plane.