Semiconductor Package Structure With Sintered Heat Spreader Bonding
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Solution Overview
Problem
The attachment or bonding between the heat spreader and the semiconductor package structure is a critical issue, as the semiconductor die or chip may shift during the molding process, leading to warpage and performance degradation.
Innovation Solution
A package structure that includes an electronic device, a heat spreader, an intermediate layer made of sintered material, and an encapsulant, where the intermediate layer is interposed between the electronic device and the heat spreader to enhance bonding and prevent shifting during the molding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader is attached to a semiconductor die or chip during the molding process, then heat dissipation performance is improved, but the semiconductor die or chip may shift from its predetermined position causing warpage
Solution Approach 1:
The patent applies preliminary action by pre-attaching the heat spreader to the semiconductor die or chip before the molding process begins. This ensures the heat spreader is securely in place before encapsulation, preventing any shifting during subsequent molding operations while maintaining heat dissipation functionality.
Solution Approach 2:
The patent introduces an intermediate layer or adhesive material as a mediator between the heat spreader and the semiconductor die/chip. This intermediary substance provides strong bonding force to secure the heat spreader in position, preventing displacement during molding while allowing effective thermal contact.
2Temperature
If a heat spreader is attached to the semiconductor package structure, then heat dissipation is improved, but severe warpage occurs in the package structure
Solution Approach 1:
The patent applies parameter changes by carefully controlling the thickness, material properties, and thermal expansion coefficients of the heat spreader and intermediate layer. By adjusting these parameters, the patent achieves effective heat dissipation while minimizing differential thermal stress that causes warpage in the package structure.
Solution Approach 2:
The patent uses composite material structures, combining the heat spreader material with an intermediate layer having complementary mechanical and thermal properties. This composite approach balances thermal conductivity requirements with mechanical flexibility to accommodate thermal expansion differences, reducing warpage while maintaining heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a sintered intermediate layer provides a strong bonding force between the heat spreader and the electronic device, preventing shifting and warpage, thus ensuring the performance and reliability of the semiconductor package structure.
Implementation Method 1
The intermediate layer includes a sintered material
Data Source
AI summary
A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.