Sintered Power Module Structure for Low Thermal Resistance
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Solution Overview
Problem
Conventional power module structures suffer from inadequate heat dissipation due to the use of solder for joining components, leading to insufficient thermal management of power semiconductor elements.
Innovation Solution
A power module design featuring a power semiconductor element joined to a first metal circuit board via a sintering paste, with a heat dissipation sheet attached to the other side of the circuit board, resulting in a laminated structure with a total thermal resistance of 0.30 K/W or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder is used for joining power semiconductor element to metal circuit board, then ease of manufacture is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The invention changes the material parameter of the joining layer from traditional solder to sintering paste, which has superior thermal conductivity. This parameter change enables significantly improved heat dissipation performance while maintaining manufacturing feasibility through sintering processes.
Solution Approach 2:
The invention employs composite material structures including the sintering paste joining layer combined with metal circuit board and heat dissipation sheet, creating a multi-layer composite system that optimizes both thermal management and electrical performance.
2Ease of manufacture
If solder is used for joining components, then ease of manufacture is improved, but thermal resistance increases
Solution Approach 1:
The invention changes the material composition and thermal properties of the joining layer by using sintering paste instead of solder, achieving lower thermal resistance and improved reliability for high-power applications.
3Reliability
If heat dissipation performance is improved by changing joining materials, then thermal resistance decreases, but manufacturing complexity increases
Solution Approach 1:
The invention divides the power module into distinct functional layers including the sintering paste joining layer, metal circuit board, and heat dissipation sheet, allowing each component to be optimized independently while maintaining overall manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat dissipation performance by reducing thermal resistance, enhancing insulation reliability, and maintaining mechanical strength while effectively dissipating heat generated by the semiconductor element.
Implementation Method 1
a first joining layer provided for joining the power semiconductor element to one surface of the first metal circuit board by using a sintering paste
Implementation Method 2
a first heat dissipation sheet provided for joining a first heat dissipation member to the other surface of the first metal circuit board
Data Source
AI summary
A power module (10) includes a power semiconductor chip (1) and a Cu circuit (3) having the power semiconductor chip (1) provided on one surface. The power module (10) includes: a sintering layer (2) joining the power semiconductor chip (1) and the Cu circuit (3) by using a sintering paste; and a heat dissipation sheet (4) provided for joining a Cu base plate (5) to the other surface of the Cu circuit (3), in which in a first laminated structure in which the power semiconductor chip (1), the sintering layer (2), the Cu circuit (3), and the heat dissipation sheet (4) are laminated, the total thermal resistance XA in the direction of lamination is equal to or less than 0.30 (K/W).