Sintered Silver Capacitor Assembly for Low ESR Packaging
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Solution Overview
Problem
Existing capacitor assembly package structures face challenges in maintaining low equivalent series resistance (ESR) due to limitations in the materials and structures used for the capacitor elements and electrode connections.
Innovation Solution
The proposed solution involves a capacitor assembly package structure that includes a capacitor assembly with stacked capacitor structures, each featuring a sintered silver layer with over 95% pure silver, an insulating package body for encapsulation, and an electrode assembly for electrical connection. This configuration aims to reduce the thickness and resistivity of the silver layers, thereby minimizing ESR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional silver glue material (epoxy resin mixed with silver powder) is used for electrode connections, then the manufacturing process is simple, but the resistivity is high and ESR cannot be sufficiently reduced
Solution Approach 1:
The patent changes the material composition parameters by using high-purity silver (≥95%) instead of silver powder mixed in epoxy resin, and controls the thickness parameter to be ≤1μm. This parameter change achieves lower resistivity and ESR while maintaining manufacturing feasibility through the sintering process
Solution Approach 2:
The patent creates a composite structure by combining the sintered silver layer with the capacitor electrode and insulating package body. The sintered silver layer acts as a distinct functional material layer with superior electrical properties compared to traditional homogeneous silver glue
2Reliability
If the thickness of silver layers is reduced to lower ESR, then the resistivity decreases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical coating methods with a sintering process that forms the silver layer through thermal energy. This substitution enables precise thickness control (≤1μm) and high-purity silver structure without requiring extremely precise mechanical deposition control
Solution Approach 2:
The patent changes the physical state parameter of silver from powder suspension in epoxy to sintered solid structure. This parameter change allows the formation of thin, uniform layers with controlled thickness and superior electrical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of high-purity sintered silver layers with reduced thickness achieves lower resistivity compared to traditional silver glue materials, effectively reducing or maintaining the equivalent series resistance of the capacitor assembly package structure.
Implementation Method 1
the sintered silver layer and the capacitor electrode are electrically connected to each other... a resistivity of the sintered silver layer can be less than a resistivity of a silver glue material
Implementation Method 2
an average thickness of the sintered silver layer can be less than or equal to 1 μm, and a resistivity of the sintered silver layer can be less than a resistivity of a silver glue material formed by mixing epoxy resin and silver powder, so as to reduce or maintain the equivalent series resistance
Data Source
AI summary
A capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate a plurality of the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. Each of the capacitor structures includes a sintered silver layer, and the sintered silver layer includes more than 95% pure silver material. The average thickness of the sintered silver layer can be less than or equal to 1 μm, and the resistivity of the sintered silver layer can be less than the resistivity of a silver glue material formed by mixing epoxy resin and silver powder.