Sintered Compact Substrate Planarization for LED Heat Dissipation
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Solution Overview
Problem
Current sintered compact substrates lack effective thermal conductivity and planarization, which hinders their performance in high heat dissipation applications, such as in light-emitting devices.
Innovation Solution
A method for manufacturing a sintered compact substrate involving a ceramic substrate with recessed portions filled with conductive pastes, followed by firing and polishing to form conductors and metal layers, ensuring the substrate's surfaces are flush and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional resin embedding is used between wiring layers, then insulation is provided, but thermal conductivity is insufficient for high heat dissipation applications
Solution Approach 1:
The patent changes the material parameter from conventional resin to sintered compact material with controlled porosity and composition. The sintered compact is formed by sintering metal powder with binder resin, creating a material that maintains structural integrity while providing superior thermal conductivity pathways through the metal particle network, directly addressing the heat dissipation requirement without complicating the manufacturing process
Solution Approach 2:
The invention uses a composite material structure where metal powder particles are embedded in a binder resin matrix, then sintered together. This composite approach combines the thermal conductivity of metal particles with the structural properties of the resin binder, achieving both high heat dissipation and ease of manufacture through a single integrated material solution
2Manufacturing precision
If metal layers are formed on uneven surfaces, then electrical connectivity is achieved, but planarization is poor and subsequent processing is difficult
Solution Approach 1:
The patent performs preliminary planarization by polishing or grinding the sintered compact surface before forming the metal layer. This preliminary action creates a flat baseline surface that ensures uniform metal layer deposition and eliminates the need for additional polishing steps after metal formation, reducing overall device complexity while maintaining high manufacturing precision
Solution Approach 2:
The invention controls the surface topology parameters of the sintered compact through adjusted polishing or grinding processes. By optimizing the surface roughness and flatness parameters before metal layer formation, the patent achieves excellent planarization that facilitates uniform electrical connectivity without requiring complex multi-step polishing procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting sintered compact substrate achieves excellent thermal conductivity and planarization, improving heat dissipation and reliability in light-emitting devices by ensuring smooth surfaces for uniform metal layer formation and enhanced electrical connectivity.
Implementation Method 1
disposing a first conductive paste containing a first metal powder in the first arrangement portion, obtaining a first conductor by firing the first conductive paste
Implementation Method 2
forming a plurality of first recessed portions on a surface of the first conductor disposed in the first arrangement portion by polishing or grinding at least one of the first conductor or the ceramic substrate
Data Source
AI summary
A method includes providing a ceramic substrate having a first arrangement portion recessed from a first planar portion; disposing a first conductive paste containing a first metal powder in the first arrangement portion; obtaining a first conductor by firing the first conductive paste; forming first recessed portions on a surface of the first conductor disposed in the first arrangement portion by polishing the first conductor and the ceramic substrate so that the first conductor and the first surface form a same plane; disposing a second conductive paste containing a second metal powder and a second organic resin binder in the first recessed portions; obtaining a second conductor by curing the second conductive paste; polishing the second conductor so that the second conductor and the first conductor form the same plane; and forming a first metal layer on surfaces of the first conductor and the second conductor.