Sintered Temperature Sensor Assembly for Miniaturized Contacting
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Solution Overview
Problem
The increasing miniaturization of temperature sensors makes reliable electrical contacting of their contact surfaces difficult, especially with methods like wire bonding and soldering, leading to assembly challenges.
Innovation Solution
A temperature-sensor assembly with a flexible supply line connected to a sensor-contact surface via a sinter layer, allowing easy handling and simple connection to further components, utilizing a pre-applied sinter-paste layer for mechanical and electrical bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding or soldering is used to contact temperature sensor surfaces, then electrical contacting can be achieved, but the process becomes increasingly difficult as sensor dimensions are reduced
Solution Approach 1:
The patent changes the physical state and properties of the connection material by using a sinter layer that transitions from a pre-applied paste to a sintered connection layer. This parameter change enables reliable electrical contact on miniaturized sensor surfaces without the complexity of wire bonding or soldering, as the sintering process creates direct metal-to-metal contact through controlled heating and pressure.
2Volume of moving object
If temperature sensor contact surfaces are miniaturized, then sensor size is reduced, but reliable electrical contacting becomes increasingly difficult
Solution Approach 1:
The patent applies a pre-applied sinter-paste layer to the sensor contact surfaces before the final assembly. This preliminary action ensures that the connection material is already in position and properly prepared for sintering, enabling reliable electrical contact even on miniaturized sensor surfaces where precise positioning is critical.
3Length of moving object
If the temperature sensor is miniaturized, then the sensor dimensions are reduced, but assembly and contacting become increasingly difficult
Solution Approach 1:
The patent merges the supply line connection and sensor contacting into a single integrated assembly step. The flexible supply line with pre-applied sinter paste is positioned and sintered directly onto the sensor contacts, combining multiple operations into one process that simplifies assembly of miniaturized sensors.
Solution Approach 2:
The patent uses a flexible supply line that can be positioned and adapted to the sensor location before sintering. This dynamic positioning capability allows the supply line to accommodate various sensor positions and orientations, making assembly easier despite miniaturization.
4Strength
If a sinter layer is used to connect supply line to sensor-contact surface, then mechanical and electrical connection is achieved, but the process requires additional steps
Solution Approach 1:
The patent applies the sinter paste in advance to either the supply line or sensor surface before assembly. This preliminary preparation eliminates the need for separate paste application and positioning steps during final assembly, reducing process complexity while maintaining strong mechanical and electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy assembly and reliable connection of temperature sensors to components, enhancing handling and connection simplicity while maintaining electrical integrity.
Implementation Method 1
The supply-line contact surface (9) is connected to the sensor-contact surface (8) at least in part by means of a first sinter layer (10)
Data Source
AI summary
A temperature-sensor assembly comprising at least one temperature sensor and at least one supply line, wherein the temperature sensor has at least one electrically insulating substrate with an upper side and an underside, wherein a temperature-sensor structure with at least one sensor-contact surface is formed at least on parts of the upper side, wherein the supply line has at least one supply-line contact surface, wherein the supply-line contact surface is connected to the sensor-contact surface at least in part by means of a first sinter layer.