Sintered Wick Heat Exchanger for Thin Electronic Devices
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Solution Overview
Problem
Existing heat exchangers for electronic devices are not sufficiently rigid, thin, durable, or cost-effective, and their manufacturing methods generate significant waste and inefficiencies due to the use of wire mesh wicking elements.
Innovation Solution
A heat exchanger design featuring sintered metal wick material with controlled porosity and reduced-height areas, integrated between two plates with peripheral sealing surfaces, allowing for efficient fluid circulation and structural support, and a manufacturing method using molding and sintering to minimize waste and enhance rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If wire mesh wicking elements are used in vapor chambers, then heat dissipation function is achieved, but manufacturing waste increases significantly (50-80% scrap)
Solution Approach 1:
The patent replaces wire mesh with a porous wick material that has controlled porosity (30-70%) to enable capillary action for fluid circulation. This porous structure provides the necessary wicking function while eliminating the need for complex wire mesh geometries, thereby reducing manufacturing waste significantly.
Solution Approach 2:
The patent changes the physical parameters of the wick material by controlling its porosity within a specific range (30-70%). This parameter optimization allows the wick to provide adequate capillary action for heat dissipation while using less material and simplifying manufacturing, thus reducing waste.
2Length of moving object
If thin heat exchangers are designed for electronic devices, then device compactness is improved, but structural rigidity deteriorates
Solution Approach 1:
The patent uses a composite structure combining a thin heat exchanger body with a porous wick material having controlled porosity. This composite design allows the overall structure to remain thin while the optimized porous wick provides sufficient structural support and rigidity, resolving the contradiction between thinness and strength.
Solution Approach 2:
The patent applies local quality optimization by designing the porous wick with specific porosity (30-70%) in different regions to provide localized structural support where needed. This allows the heat exchanger to be thin overall while maintaining rigidity in critical areas through the optimized porous structure.
3Productivity
If conventional manufacturing methods are used for vapor chambers, then production capability is maintained, but manufacturing costs increase due to material waste
Solution Approach 1:
The patent optimizes the porosity parameter of the wick material (30-70%) to achieve the best balance between wicking performance and material usage. This parameter optimization reduces material waste while maintaining production capability, thereby lowering manufacturing costs without sacrificing productivity.
Solution Approach 2:
By using porous materials with controlled porosity instead of wire mesh, the patent simplifies the manufacturing process and reduces material waste. The porous structure can be more easily fabricated with fewer steps, maintaining production capability while significantly reducing material costs and waste disposal costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal management with reduced material waste and manufacturing costs, increased structural integrity, and enhanced heat dissipation efficiency across the surface area of electronic devices.
Implementation Method 1
The condensed working fluid is then wicked back to the area of the chip by capillary flow to repeat the cycle
Implementation Method 2
Heat from the computer chip is transferred to the working fluid, which is vaporized and circulated through internal gas flow passages
Implementation Method 3
the heat of the computer chip is transported away from the chip as latent heat of evaporation
Implementation Method 4
where its temperature drops and it uses the larger fin area to condense, releasing the heat of condensation in areas away from the chip
Implementation Method 5
Heat from the computer chip is transferred to the working fluid
Data Source
AI summary
Methods and system are provided for a heat exchanger. In one example, a system, comprises a mobile electronic device comprising a front cover and a rear cover, a heat exchanger arranged between the front cover and the rear cover, the heat exchanger comprising a fluid chamber arranged between an inner surface of a first plate and an inner surface of a second plate, and a wick material arranged within the fluid chamber, the wick material comprising a sintered material configured to allow a plurality of fluid passages to extend therethrough.