Sintering Press Heat Diffusion Layout for Load Cell Protection
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Solution Overview
Problem
Sintering presses face challenges in bringing substrates to sintering temperature without overheating other components, such as load cells, which must operate at lower temperatures, while maintaining mechanical performance.
Innovation Solution
The sintering press incorporates a heat diffusion plate made of high thermal conductivity material like copper, which is in contact with a steel element plate to transmit heat for sintering and a cooling circuit to maintain the load cell at a lower temperature, ensuring the load cell operates effectively without excessive energy expenditure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is heated to sintering temperature (greater than 200°C), then the sintering process can be performed, but the load cells and other electronic components will overheat and cannot operate correctly
Solution Approach 1:
The base is divided into two distinct zones: a first zone that contacts the substrate and is heated to sintering temperature, and a second zone that houses the load cells and maintains lower temperature. This spatial segmentation allows different temperature conditions to coexist within the same base structure, enabling the substrate to reach sintering temperature while protecting the load cells from overheating.
Solution Approach 2:
A thermal barrier or insulation structure acts as an intermediary between the heated first zone and the load cell housing second zone. This intermediary prevents direct heat transfer to the load cells, allowing the substrate to be heated to sintering temperature while maintaining a safe operating temperature for the electronic components.
2Temperature
If the entire press is heated to sintering temperature, then uniform heating is achieved, but the mechanical performance of the press is compromised
Solution Approach 1:
The base is segmented into a heated first zone for substrate processing and a non-heated second zone for load cells and electronics. This segmentation allows localized heating only where required for sintering, maintaining uniform temperature distribution in the substrate zone while preserving mechanical strength in the load cell zone by avoiding excessive heating.
3Use of energy by stationary object
If the load cells are exposed to high temperature, then the sintering heat can be effectively transmitted, but the load cells cannot operate at temperatures much lower than sintering temperature
Solution Approach 1:
The base is divided into a first zone that receives and transmits sintering heat to the substrate, and a second zone that protects the load cells from high temperature. This segmentation enables effective heat transmission to the substrate while maintaining a temperature gradient that protects the load cells from overheating.
Solution Approach 2:
A thermal barrier or insulation structure serves as an intermediary between the heated first zone and the load cell housing second zone. This intermediary allows heat to be effectively transmitted to the substrate while preventing excessive heat from reaching the load cells, ensuring they operate within their temperature limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient heating of substrates to sintering temperatures while keeping load cells at a safe operating temperature, maintaining mechanical performance and reducing energy consumption.
Implementation Method 1
a heat diffusion plate made of high thermal conductivity material like copper, which is in contact with a steel element plate to transmit heat for sintering
Implementation Method 2
a cooling circuit to maintain the load cell at a lower temperature, ensuring the load cell operates effectively without excessive energy expenditure
Data Source
AI summary
A sintering press for sintering electronic components on a substrate is provided. The sintering press includes a pressing unit having a plurality of controllable presser rods to apply sintering pressure to the electronic components to be sintered, reaction elements forming a support plane for a respective substrate, an element plate slidably supporting the reaction elements, and a heating circuit with heating elements embedded in a heating body placed around the element plate to bring the element plate to a sintering temperature. A heat diffusion plate is placed in contact with the heating body and extends onto the element plate between the reaction elements, the diffusion plate being made of a material having a higher thermal conductivity than the element plate.