Sinusoidal Heater and Coanda Injector for Substrate Uniformity
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Solution Overview
Problem
Current substrate processing technologies face challenges in achieving uniformity in layer thickness, composition, and temperature across substrates during chemical and thermal processing, particularly in microelectronic device manufacturing, where processes like CVD and epitaxial semiconductor deposition require precise control to ensure consistent device performance.
Innovation Solution
A system comprising a process chamber with a sinusoidal heating element and a Coanda effect gas injector is used, where the heating element provides a constant heat flux and the Coanda effect gas flow ensures uniform gas distribution over the substrate, enhancing temperature and composition uniformity during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating systems are used, then substrate heating can be achieved, but temperature uniformity across the substrate is poor
Solution Approach 1:
The heating system is divided into multiple independently controllable heating zones along the substrate processing path. Each zone can be adjusted to provide uniform heat distribution across different regions of the substrate, eliminating temperature gradients and improving layer deposition uniformity.
Solution Approach 2:
Different regions of the heating system are optimized with specific thermal characteristics tailored to local requirements. The heating zones are designed to provide appropriate temperature profiles for different stages of substrate processing, ensuring uniform temperature distribution while maintaining manufacturing precision.
2Quantity of substance
If conventional gas injection systems are used, then gas flow can be provided, but gas distribution uniformity is poor
Solution Approach 1:
The gas injection system is segmented into multiple injection points distributed along the substrate processing path. Each injection point delivers gas to a specific zone, and the combined effect creates uniform gas distribution across the entire substrate surface, improving composition uniformity during processing.
Solution Approach 2:
Gas injection is transitioned from a single-point or centralized approach to a distributed multi-dimensional injection pattern. Gas is introduced at multiple locations and angles to create uniform coverage across the substrate, ensuring consistent gas-phase reactant distribution for homogeneous material deposition.
3Manufacturing precision
If processing is performed to achieve desired layer properties, then manufacturing can proceed, but achieving uniformity in layer thickness and composition is difficult
Solution Approach 1:
Multiple processing functions (heating, gas injection, substrate support) are merged into an integrated processing system with coordinated control. The unified system design allows simultaneous optimization of temperature and gas distribution fields, achieving uniform layer properties without requiring separate complex subsystems.
Solution Approach 2:
The processing system incorporates monitoring and feedback mechanisms that real-time adjust heating power and gas flow rates based on actual deposition conditions. This closed-loop control maintains uniform layer thickness and composition while managing system complexity through automated regulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved uniformity in substrate processing, leading to more consistent and reliable microelectronic device manufacturing by maintaining constant heat flux and gas distribution, thereby enhancing layer deposition quality.
Implementation Method 1
The heating system comprises at least one electrical resistance heater comprising a sinusoidal heating element
Implementation Method 2
at least one Coanda effect gas injector disposed proximate a peripheral edge of the substrate support so as to provide a Coanda effect gas flow over the surface of the substrate(s)
Data Source
AI summary
A system for processing substrates is described. In one embodiment, the system comprises a process chamber, at least one electrical resistance heater, and at least one Coanda effect gas injector.