Stacked SiOxNy Thin-Film Packaging for Flexible OLED Bending Stress

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Solution Overview

Problem

Traditional thin film packaging structures for flexible OLED devices face issues with stress and separation when bent, leading to reduced bendability and reliability, especially due to the brittleness of inorganic layers.

Innovation Solution

A thin film packaging structure is designed with a first inorganic packaging layer, an organic packaging layer, and at least one inorganic adjusting layer with a higher elasticity modulus than the packaging layers, strategically positioned to absorb stress and prevent separation, improving the structural stability and bendability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional thin film packaging structure with inorganic and organic layers is used, then water and oxygen protection is achieved, but the inorganic layer experiences greater stress when bent and may be easily broken

Engineering Contradiction:

Improveprotection against water and oxygenVSAvoidbending strength of inorganic layer

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining inorganic packaging layers with organic packaging layers in a multi-layer structure. The inorganic layers provide barrier properties against water and oxygen, while the organic layers provide flexibility and stress relief, creating a composite structure that balances protection and bending strength.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent introduces inorganic adjusting layers with different elasticity moduli at specific locations within the packaging structure. These adjusting layers have higher elasticity modulus than the inorganic packaging layers, providing localized stress concentration and control at critical bending points to prevent breakage while maintaining overall structural integrity.

Inventive Principle:

Principle #3Local quality

2Reliability

If traditional thin film packaging structure is used, then packaging function is achieved, but film layers may be easily separated reducing bendability

Engineering Contradiction:

Improvepackaging functionVSAvoidbendability

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The multi-layer composite structure alternates between inorganic and organic materials, where each layer type compensates for the weaknesses of the other. The organic layers act as flexible spacers and stress distributors that prevent delamination between inorganic layers, maintaining both packaging function and bendability.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the elasticity modulus parameter by introducing inorganic adjusting layers with specifically controlled higher elasticity modulus values. This parameter change creates a gradient structure that manages stress distribution during bending, preventing layer separation while maintaining the packaging barrier function.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12144197B2Thin film packaging structure including stacked SiOxNy layers

Publication Date: 2024.11.12 CHENGDU BOE OPTOELECTRONICS TECH CO LTD

AI summary

A thin film packaging structure includes a first inorganic packaging layer for covering a device to be packaged; an organic packaging layer formed at a side of the first inorganic packaging layer; a second inorganic packaging layer formed at a side of the organic packaging layer facing away from the first inorganic packaging layer; and at least one first inorganic layer formed at a side of the first inorganic packaging layer facing away from the device to be packaged. The at least one first inorganic layer has an elasticity modulus greater than that of the first inorganic packaging layer or the second inorganic packaging layer. The present disclosure also provides a display panel.