System-in-Package Carrier Board for PCB Area and Cost Reduction
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Solution Overview
Problem
The increasing number of components on printed circuit boards (PCBs) leads to larger areas and higher costs, limiting miniaturization and compatibility flexibility due to constraints on power supply, wiring, solder ball distance, and I/O pin layout, making it difficult to integrate components that do not meet these constraints without redesigning the PCB.
Innovation Solution
A system-in-package component that includes a carrier board with packaged electronic components, allowing for electrical connections between components without the need for additional PCB layers, thereby reducing the number of components on the PCB and enabling miniaturization and improved compatibility flexibility by using a first carrier board to connect components that do not comply with PCB constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more components are integrated into the PCB, then the functionality of the electronic device is improved, but the area of the PCB becomes larger and costs increase
Solution Approach 1:
The patent segments the electronic components from the PCB by creating a separate system-in-package module. Multiple electronic components are integrated into a carrier board that is packaged as a single unit, which then connects to the PCB through a reduced number of I/O pins. This segmentation allows the PCB area to be reduced while maintaining the functionality of multiple components.
Solution Approach 2:
The patent implements nesting by placing multiple electronic components inside a packaged carrier board structure. The carrier board with multiple components is treated as a single nested unit that connects to the PCB, effectively hiding the complexity and area of multiple components within a compact packaged structure.
2Adaptability or versatility
If more components are integrated into the PCB, then the functionality of the electronic device is improved, but the costs of the PCB become higher
Solution Approach 1:
By segmenting multiple components into a separate packaged module, the PCB design requires fewer layers and less complex routing, thereby reducing manufacturing costs. The complex multi-component integration is moved to the packaged module where it can be manufactured separately and then attached as a single unit.
Solution Approach 2:
The patent merges multiple electronic components into a single packaged system-in-package module. This combining reduces the number of separate component placements and connections required on the PCB, simplifying the PCB manufacturing process and reducing overall costs.
3Adaptability or versatility
If components that do not meet PCB constraints are integrated, then the compatibility flexibility is improved, but the PCB needs to be redesigned
Solution Approach 1:
The carrier board acts as an intermediary between components that do not meet PCB constraints and the PCB itself. The carrier board provides the necessary adaptation and interface, allowing components with non-standard configurations to be integrated without requiring PCB redesign. The carrier board absorbs the complexity of constraint compliance.
Solution Approach 2:
The packaged carrier board serves as a universal interface that can accommodate various types of electronic components regardless of their individual PCB constraint compliance. The single package unit provides multi-functional integration, allowing different component configurations to be connected to the PCB through a standardized interface.
Data Source
AI summary
This application provides a system-in package component, an electronic device, and a system-in package component manufacturing method, to improve compatibility flexibility of a PCB with a component, reduce an area of the PCB, and reduce costs of the PCB. The system-in package component includes: a first carrier board; a plurality of electronic components, separately disposed on the first carrier board, where the first carrier board is configured to implement an electrical connection between at least two electronic components of the plurality of electronic components, and at least one electronic component of the plurality of electronic components includes a packaged integrated circuit; and a packaging material, configured to package the plurality of electronic components on the first carrier board.