SiP Communication Channel Self-Test for Latent Fault Detection

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Solution Overview

Problem

As integrated circuits in system in a package (SiP) designs become more compact, latent faults in communication channels, which are not static faults but can manifest due to electrical stress and aging, pose a risk of system failure without being detectable through traditional testing methods.

Innovation Solution

Incorporating transmitter and receiver control circuitry within SiP to perform built-in self-tests (BIST) for latent faults, using iterative test patterns to detect six types of latent faults, including crosstalk and timing violations, before and after deployment, and proactively repairing communication channels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional testing methods are used, then manufacturing simplicity is maintained, but latent faults cannot be detected leading to system failure risk

Engineering Contradiction:
Improvedetection of latent faultsVSAvoidtesting system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the testing system with the SiP package by integrating transmitter and receiver control circuitry directly into the package. This allows latent fault detection capabilities to be built-in without requiring separate external testing equipment, thus improving reliability while managing complexity through integration.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The SiP package performs self-testing through built-in transmitter and receiver control circuitry that can detect latent faults without external intervention. The system uses iterative test patterns to proactively identify faults, enabling the device to monitor and diagnose its own health status autonomously.

Inventive Principle:
Principle #25Self-service

2Area of moving object

If compact SiP designs are implemented, then integration density is improved, but latent faults become more difficult to detect

Engineering Contradiction:
Improveintegration densityVSAvoidlatent fault detection difficulty
Core Design Contradiction:
Area of moving objectVSDifficulty of detecting and measuring

Solution Approach 1:

The patent segments the SiP package into distinct functional components including transmitter control circuitry, receiver control circuitry, and communication channels. This segmentation allows for targeted testing of specific components and channels, making latent fault detection more manageable despite the compact integrated design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces iterative test patterns as an intermediary mechanism between the transmitter and receiver control circuitry. These test patterns serve as mediators that stimulate the communication channels and enable the detection of latent faults that would otherwise be difficult to detect in compact designs.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If iterative test patterns are used for latent fault detection, then fault detection capability is improved, but testing time increases

Engineering Contradiction:
Improvelatent fault detection capabilityVSAvoidtesting time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent employs periodic iterative test patterns that cycle through different transmission scenarios. By repeating tests with varying patterns and conditions, the system can detect latent faults that may not manifest in single-pass tests, improving detection capability while managing time through structured repetition.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent performs preliminary testing during the manufacturing and packaging phase before deployment. By conducting latent fault detection tests early in the lifecycle, the system identifies potential issues before they cause system failure in operation, reducing the need for time-consuming diagnostic testing later.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentEP4711780A1Methods, apparatus, and articles of manufacture to perform infield testing of a system in a package
Publication Date: 2026.03.18 INTEL CORP
  • EP4711780A1 patent drawingFigure 1
  • EP4711780A1 patent drawingFigure 2A~2F
  • EP4711780A1 patent drawingFigure 3A~3B

AI summary

Systems, apparatus, articles of manufacture, and methods are disclosed to perform infield testing of a system in a package. An example die includes transmit circuits to communicate via respective communication channels and control circuitry to cause a first one of the transmit circuits to send a first pattern over a first one of the communication channels. Additionally, the example control circuitry is to cause second ones of the transmit circuits to respectively send a second pattern over second respective ones of the communication channels, the second pattern being at least one of an inverse of the first pattern or identical to the first pattern.